Light-Emitting Device With Sintered Conductor Pattern
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Solution Overview
Problem
Existing snow-melting units for signs, such as those described in JP 2009-299335 A, face inefficiencies in thermal conduction due to low thermal conductivity of acrylic resin plates and require large electric power for snow melting, making them thick and obstructive, hindering visibility.
Innovation Solution
A light-emitting device with a thin, light-transmitting substrate featuring a conductor pattern directly disposed on the substrate without adhesive layers, utilizing sintered conductive particles for high thermal conductivity and porous designs to efficiently raise the substrate's surface temperature, reducing power consumption and maintaining flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an internal space is formed by facingly disposed two acrylic resin plates with a frame, then snow-melting function is achieved, but thermal conduction efficiency becomes low and device thickness increases
Solution Approach 1:
The patent changes the thermal conduction parameter by replacing the air-filled internal space with a gel filler having high thermal conductivity (0.5 to 5.0 W/mK). This parameter change enables efficient heat transfer from the heater to the acrylic resin plate surface, resolving the thermal conduction efficiency problem while maintaining the snow-melting function.
Solution Approach 2:
The patent uses a composite structure combining the acrylic resin plate with a gel filler material that has superior thermal conductivity properties. This composite approach allows the system to achieve both the structural requirements for snow-melting and the thermal conduction efficiency needed to reduce energy loss.
2Reliability
If an internal space is formed by facingly disposed two acrylic resin plates, then snow-melting function is achieved, but device thickness becomes large
Solution Approach 1:
The patent employs a thin acrylic resin plate (1 to 5 mm thick) as the outer shell, replacing the thick multi-plate structure. The gel filler enables this thinning by providing the necessary thermal conduction path within the reduced thickness, allowing the device to maintain snow-melting functionality while significantly reducing overall thickness.
3Loss of energy
If high thermal conduction efficiency is achieved, then power consumption is reduced, but device complexity increases
Solution Approach 1:
The patent utilizes a gel filler that can be introduced into the internal space through its porous or flowable characteristics before setting. This approach simplifies the manufacturing process compared to creating complex internal channels or structures, while still achieving high thermal conduction efficiency and reduced power consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a thin, flexible light-emitting device with high thermal conduction efficiency, effectively melting snow or moisture with reduced power usage while maintaining visibility through the device.
Implementation Method 1
a conductor pattern 43 that generates heat to raise temperature of a surface of the substrate 10 when an electric current is supplied thereto
Implementation Method 2
utilizing sintered conductive particles for high thermal conductivity
Data Source
Figure 1
Figure 2
Figure 3A~5B
AI summary
A thin light-transmitting substrate showing high thermal conduction efficiency, and having a function of raising surface temperature thereof is provided. The light-transmitting substrate of the present invention comprises a substrate that transmits at least a light of a predetermined wavelength, and a conductor pattern that is disposed on the substrate, and generates heat to raise temperature of the surface of the substrate when it is supplied with an electric current. The conductor pattern is directly disposed on the substrate without any adhesive layer.