Light-Emitting Element Electrode Cavities for Laser Bonding
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Solution Overview
Problem
In the mounting of light-emitting elements on electronic device substrates, insufficient laser beam irradiation can lead to inadequate metal bonding between terminal electrodes and connection electrodes, resulting in inefficient mounting of light-emitting elements.
Innovation Solution
The use of cavity portions on the terminal electrodes, which align with connection electrodes on the substrate, allows for efficient irradiation and application of thermal energy from a laser beam, facilitating eutectic joining and enhancing the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a laser beam is irradiated in the vicinity of the contact surface between the connection electrode and the terminal electrode, then metal bonding between the terminal electrode and the connection electrode is achieved, but if the laser beam cannot be sufficiently irradiated to the vicinity of the contact surface, the metal bonding may be insufficient
Solution Approach 1:
Instead of irradiating the laser beam from the conventional approach that may not reach the contact surface sufficiently, the patent inverts the approach by forming a cavity portion that directs and concentrates the laser beam irradiation precisely at the contact surface between the terminal electrode and connection electrode, ensuring sufficient thermal energy for reliable metal bonding
Solution Approach 2:
The cavity portion acts as an intermediary structure that facilitates laser beam delivery to the contact surface. The cavity portion serves as a medium that guides and concentrates the laser energy, enabling effective irradiation at the bonding interface that would otherwise be difficult to achieve
2Reliability
If the laser beam is sufficiently irradiated to the vicinity of the contact surface, then reliable metal bonding is achieved, but the mounting process complexity increases due to the need for precise laser positioning and cavity formation
Solution Approach 1:
The cavity portion is formed in advance during the light-emitting element fabrication process, before the mounting operation. This preliminary action prepares the structure for optimal laser bonding, eliminating the need for complex real-time adjustments during mounting and simplifying the overall process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures effective metal bonding between the light-emitting elements and the substrate, improving the mounting efficiency and strength of the light-emitting elements on the electronic device.
Implementation Method 1
a laser beam is irradiated in the vicinity of the contact surface from a light-emitting element side, thus metal-bonding the terminal electrode of the light-emitting element to the connection electrode on the array substrate by the thermal energy of the laser beam
Implementation Method 2
metal-bonding the terminal electrode of the light-emitting element to the connection electrode on the array substrate by the thermal energy of the laser beam
Data Source
AI summary
According to one embodiment, a lighting-emitting element includes a light-emitting portion, a first terminal electrode and a second terminal electrode. The first terminal electrode includes a first cavity portion at a position overlapping a first connection electrode in planar view when the first terminal electrode is brought into contact with the first connection electrode. The second terminal electrode includes a second cavity portion at a position overlapping a second connection electrode in planar view when the second terminal electrode is brought into contact with the second connection electrode.