Light Emitting Element External Connection Segmentation for Thermal Stress
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Solution Overview
Problem
Light emitting elements face breakage of insulating films and electrodes due to thermal stress during substrate bonding, which compromises heat dissipation performance.
Innovation Solution
A light emitting element design featuring a semiconductor layered body with exposed portions arranged in columns, covered by an insulating film with electrodes connected through openings, and external connection parts spaced apart to reduce stress concentration and enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the area of external connection parts is increased to secure heat dissipation performance, then heat dissipation performance is improved, but thermal stress concentration during substrate bonding increases causing breakage of insulating film and electrode
Solution Approach 1:
The external connection parts are divided into multiple segments arranged in a columnar pattern rather than using a single large continuous structure. This segmentation distributes the thermal stress across multiple smaller units, preventing stress concentration that would cause breakage while collectively providing sufficient heat dissipation area
Solution Approach 2:
The insulating film thickness is varied in different regions: it is thicker in areas where external connection parts are present to provide enhanced stress resistance, and thinner in other areas to reduce overall capacitance. This local differentiation allows the structure to simultaneously handle thermal stress and maintain electrical performance
Data Source
AI summary
A light emitting element includes a semiconductor layered body, an insulating film, first and second electrodes, and first and second external connection parts. The first semiconductor layer is exposed from the light emitting layer and the second semiconductor layer at exposed portions arranged in columns each extending in a first direction. The insulating film defines openings respectively located above the exposed portions. The first electrode is connected to the first semiconductor layer through the openings and covers a part of the second semiconductor layer via the insulating film. The first external connection part is connected to the first electrode and spaced apart from the exposed portions in the plan view. The first external connection part has a shape elongated in the first direction between adjacent ones of the columns of the exposed portions. The second external connection part is connected to the second semiconductor layer via the second electrode.