Light-emitting element package with nested wire protection
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Solution Overview
Problem
Light emitting element packages face issues with wire damage from external impact and oxidation, as well as reliability concerns in wire bonding, and lack high contrast between turning-on and turning-off.
Innovation Solution
The package design includes a substrate with a conductive layer, light emitting chips, wires, a wavelength conversion unit, and a molding part that encloses the chips and wires, with specific distance and alignment configurations to protect the wires and enhance reliability, using materials like black resin to absorb light and improve contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires are exposed in the package, then wire bonding is accessible, but wires are damaged by external impact and oxidized
Solution Approach 1:
The wavelength conversion unit is designed to enclose the wire within its structure, nesting the wire inside the unit. This provides physical protection against external impact and prevents exposure to oxidizing environments, while still allowing the wire to perform its electrical connection function between the light emitting chip and the conductive layer.
Solution Approach 2:
The wavelength conversion unit acts as an intermediary structure that simultaneously serves multiple functions: it protects the wire from harmful external factors while allowing the wire to maintain its electrical connectivity. The unit mediates between the need for wire protection and the need for wire accessibility.
2Volume of stationary object
If the wavelength conversion unit is positioned close to the light emitting chip, then the package size is reduced, but wire protection is compromised
Solution Approach 1:
The wire is nested within the wavelength conversion unit, allowing the unit to provide protection while maintaining a compact overall structure. This nesting arrangement enables the package to be space-efficient without compromising wire protection, as the protective structure integrates with rather than adds to the overall volume.
3Object-affected harmful factors
If the molding part encloses the wire completely, then wire protection is maximized, but light output and contrast are reduced
Solution Approach 1:
The wavelength conversion unit provides localized protection only where the wire is positioned, rather than enclosing the entire package. This selective protection approach allows the molding part to remain open or transparent in regions where light emission is required, maintaining high light output and contrast while still protecting the wire from damage and oxidation.
Solution Approach 2:
The wire is nested within the wavelength conversion unit which itself is positioned within the broader package structure. This hierarchical nesting allows for differentiated protection levels: the wire gets full protection within the unit, while the overall package maintains light-emitting capabilities through the molding part's partial enclosure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively prevents wire damage and oxidation, improves wire bonding reliability, and achieves high contrast between on and off states, suitable for lighting and display applications.
Implementation Method 1
a wavelength conversion unit disposed on the at least one light emitting chip
Implementation Method 2
a molding part disposed on the substrate so as to enclose the at least one light emitting chip and the wire
Implementation Method 3
a wire configured to conductively connect the conductive layer and the at least one light emitting chip
Data Source
AI summary
A light-emitting element package according to an embodiment comprises: a substrate; a conductive layer arranged on the substrate; at least one light-emitting chip arranged on the substrate; a wire for electrically connecting the conductive layer and the at least one light-emitting chip; a wavelength conversion unit arranged on the light-emitting chip; and a molding unit arranged on the substrate so as to enclose the light-emitting chip and the wire and to expose the upper surface of the wavelength conversion unit, wherein the distance from the upper surface of the light-emitting chip to the upper surface of the wavelength conversion unit is larger than a value obtained by adding 37 μm to the distance from the upper surface of the light-emitting chip to the highest point of the wire.