Light Emitting Apparatus Mounting Force Distribution

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Solution Overview

Problem

Existing light emitting devices face issues with stress and strain due to excessive pressure during mounting, leading to unstable light emission characteristics and potential breakage of the active layer.

Innovation Solution

A light emitting apparatus is designed with a laminate structure that includes a first semiconductor layer, a light emitting layer, and a second semiconductor layer, where a first member is connected between a first base and a second base to distribute the mounting force, reducing pressure on the light emitter and preventing concentration of force on the laminate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the surface electrode of the laser chip is bonded to the mount with solder material in junction-down mounting, then heat dissipation is improved, but excessive pressure acts on the active layer causing stress and strain

Engineering Contradiction:

Improveheat dissipationVSAvoidpressure on active layer

Core Design Contradiction:

TemperatureVSStress or pressure

Solution Approach 1:

The patent segments the bonding structure by introducing a first member (support structure) that is bonded to the mount separately from the laminate. This divides the pressure-bearing function from the light-emitting function, allowing the active layer to be protected while still achieving heat dissipation through the junction-down mounting configuration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first member acts as an intermediary between the mount and the laminate. It receives the bonding force from the solder material and transfers it to the mount, preventing direct transmission of excessive pressure to the active layer while maintaining the thermal conduction path for heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of manufacture

If the surface electrode is directly bonded to the mount, then manufacturing is simplified, but the active layer experiences stress and strain leading to unstable light emission

Engineering Contradiction:

Improvemounting process simplicityVSAvoidlight emission stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The bonding process is segmented into two independent bonding operations: bonding the first member to the mount, and bonding the laminate to the first member. This segmentation allows each bonding step to be optimized independently, maintaining manufacturing simplicity while ensuring the active layer is protected from excessive stress.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first member is bonded to the mount beforehand to create a cushioning layer that will absorb and distribute the bonding pressure before the laminate is attached. This prior cushioning prevents excessive pressure from being transmitted to the active layer during the subsequent bonding of the laminate.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces stress and strain on the light emitter, resulting in a stable light emission characteristic and a reliable light emitting apparatus with improved heat dissipation and airtight encapsulation, while simplifying manufacturing and reducing the size of the apparatus.

Implementation Method 1

a light emitting layer provided between the first semiconductor layer and the second semiconductor layer and capable of emitting light when current is injected into the light emitting layer

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

the first member has one end connected to the first base and another end connected to the second base... force applied when the laminate is mounted on the second base is distributed to the laminate and the first member

Methodology Applied

Scientific EffectForce distribution:

Data Source

PatentUS11239390B2Light emitting apparatus, projector, method for manufacturing light emitting apparatus

Publication Date: 2022.02.01 SEIKO EPSON CORP

AI summary

A light emitting apparatus including a light emitting device including a first base at which a laminate is provided, a second base at which the light emitting device is provided, and a first member provided between the first base and the second base, wherein the laminate includes a light emitter, the light emitter includes a first semiconductor layer, a second semiconductor layer of a conductivity type different from the conductivity type of the first semiconductor layer, and a light emitting layer provided between the first semiconductor layer and the second semiconductor layer and capable of emitting light when current is injected into the light emitting layer, the first member has one end connected to the first base and another end connected to the second base, and the laminate is connected to the second base on the side opposite the first base.