Light-Emitting Electrode Layout With Insulated Heat Transfer Path

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing light-emitting devices inefficiently dissipate heat generated by the light-emitting element, as heat is primarily transferred from the electrode to the base material, leading to inadequate thermal management.

Innovation Solution

Incorporating a heat transfer member with a high thermal conductivity, acting as an insulator, which contacts both the electrode and a connection portion on the base material, allowing heat to be transferred from the electrode to the connection portion in a direction different from the current flow, thereby enhancing heat dissipation without electrical conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If heat is transferred only from the electrode to the base material, then the structure is simple, but heat dissipation efficiency is insufficient

Engineering Contradiction:
Improvestructural simplicityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

A heat transfer member is introduced as an intermediary component between the electrode and the connection portion. This heat transfer member includes a heat transfer portion contacting the electrode and a connection portion contacting the base material, enabling efficient heat conduction while maintaining electrical insulation. The intermediary structure resolves the contradiction by adding a dedicated thermal management component without significantly complicating the overall device architecture.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat transfer member is divided into distinct functional portions: a heat transfer portion that contacts the electrode and a connection portion that contacts the base material. This segmentation allows each portion to be optimized for its specific function - the heat transfer portion for thermal conduction and the connection portion for structural integration - thereby improving heat dissipation efficiency while maintaining manufacturing simplicity.

Inventive Principle:
Principle #1Segmentation

2Temperature

If a heat transfer member is added to improve heat dissipation, then heat dissipation efficiency increases, but device complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidstructural complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat transfer member is designed to perform multiple functions simultaneously: it serves as a thermal conduction path, an electrical insulator, and a structural connector between the electrode and base material. By integrating these multiple functions into a single component, the design improves heat dissipation without proportionally increasing device complexity, as the heat transfer member replaces or supplements existing structural elements rather than adding entirely new components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If the heat transfer member contacts both the electrode and connection portion, then thermal conductivity improves, but electrical insulation must be maintained

Engineering Contradiction:
Improvethermal conductivityVSAvoidelectrical insulation
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The heat transfer member is constructed from composite materials or material combinations that provide both high thermal conductivity and electrical insulation properties. This may involve using ceramic materials, polymer composites with high thermal conductivity fillers, or layered structures combining different materials. The composite material approach resolves the contradiction by inherently providing both thermal and electrical properties in a single component.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

Different portions of the heat transfer member may have different material properties optimized for their specific functions. The heat transfer portion contacting the electrode may use materials with higher thermal conductivity, while portions closer to the base material or connection points may use materials with better insulation properties. This local quality differentiation allows optimal thermal management while maintaining electrical insulation throughout the structure.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration efficiently dissipates heat from the light-emitting element, maintaining electrical separation and increasing the contact area for improved thermal conductivity, allowing for higher output and duty ratio operation of the light-emitting device.

Implementation Method 1

a heat transfer member that includes a contact surface along the front surface of the base material, the contact surface being in contact with a front surface of the electrode and a front surface of the connection portion, the heating transfer member being configured to transfer heat from the electrode to the connection portion

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP4064371B1Light-emitting device and optical measurement device
Publication Date: 2023.12.13 FUJIFILM BUSINESS INNOVATION CORP
  • EP4064371B1 patent drawingFigure 1
  • EP4064371B1 patent drawingFigure 2
  • EP4064371B1 patent drawingFigure 3

AI summary

A light-emitting device includes: a base material; an electrode that is disposed on a front surface of the base material, that has a light-emitting element on a front surface of the electrode, and that is electrically connected to the light-emitting element; a connection portion disposed at a position separated from the electrode on the front surface of the base material and connected to a conductive portion having a reference potential; and a heat transfer member that includes a contact surface along the front surface of the base material, the contact surface being in contact with a front surface of the electrode and a front surface of the connection portion, the heat transfer member being configured to transfer heat from the electrode to the connection portion.