Light Emitting Device Humidity Compensation for Optical Measurement Accuracy
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Solution Overview
Problem
Conventional molding technologies used in light emitting and receiving devices are prone to variations in light emission and output signals due to thermal stress and humidity, leading to inaccurate optical measurements, particularly in gas concentration measuring apparatuses.
Innovation Solution
Incorporating a molded resin portion to seal the light emitting and receiving elements, along with temperature and humidity information acquisition and compensation units, which calculate humidity information based on electrical or optical characteristics and temperature information to compensate for variations caused by temperature and humidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If molded resin portion is used to seal light emitting element, then ease of manufacture is improved, but manufacturing precision deteriorates due to thermal stress and humidity variations
Solution Approach 1:
The patent applies parameter changes by introducing temperature and humidity as compensation parameters. The system measures temperature and humidity values, calculates compensation amounts based on predetermined relationships, and applies these compensations to correct light emission intensity variations. This resolves the contradiction by maintaining ease of manufacture with molded resin while compensating for the resulting precision deterioration through dynamic parameter adjustment.
Solution Approach 2:
The patent implements feedback control by continuously measuring temperature and humidity, calculating compensation amounts based on these measurements, and applying real-time corrections to the light emission intensity. This feedback mechanism allows the system to maintain manufacturing precision despite using cost-effective molded resin sealing, as the system automatically adjusts for environmental variations affecting light output.
2Device complexity
If molded resin portion is used to seal light emitting element, then device complexity is reduced, but measurement precision deteriorates due to temperature and humidity influences
Solution Approach 1:
The patent uses parameter changes by introducing temperature and humidity compensation based on predetermined relationships. The system measures environmental parameters, calculates compensation amounts, and applies corrections to maintain measurement precision while keeping the device structure simple with molded resin sealing.
Solution Approach 2:
The patent implements feedback control by measuring temperature and humidity, calculating compensation amounts based on these measurements and predetermined relationships, and applying real-time corrections to the light emission intensity. This feedback mechanism maintains measurement precision without increasing device complexity.
3Measurement precision
If temperature and humidity compensation is implemented, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent applies parameter changes by measuring temperature and humidity and applying compensation based on predetermined relationships. This approach improves measurement precision through mathematical correction rather than complex hardware modifications, thus minimizing the increase in device complexity.
Solution Approach 2:
The patent implements feedback control with a practical implementation that balances precision improvement and complexity management. By using predetermined compensation relationships and processing measured temperature and humidity values through calculation units, the system achieves high measurement precision while maintaining relatively simple device architecture.
4Productivity
If conventional molding technology is used, then productivity is improved, but reliability deteriorates due to variations in light emission
Solution Approach 1:
The patent applies parameter changes by introducing temperature and humidity compensation mechanisms. This allows the system to maintain high productivity through conventional molded resin manufacturing while improving reliability by compensating for environmental variations that cause light emission fluctuations, thus resolving the contradiction between productivity and reliability.
Solution Approach 2:
The patent implements feedback control that maintains productivity by working with conventional molded resin structures while improving reliability through real-time measurement and compensation of temperature and humidity effects on light emission. The feedback mechanism corrects variations without requiring complex manufacturing processes.
Data Source
AI summary
A light emitting device including: a light emitting element; a molded resin portion configured to seal at least a portion of the light emitting element; a temperature information acquiring unit configured to acquire temperature information; a humidity information calculating unit configured to calculate humidity information, based on information relating to at least either electrical characteristics or optical characteristics of the light emitting element and the temperature information; and a controlling unit configured to control the light emitting element, based on the temperature information and the humidity information.