Light-Emitting Element Insulation Structure Against Oxygen Diffusion
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Solution Overview
Problem
Existing light-emitting elements suffer from surface defects and oxygen diffusion, leading to reduced efficiency and reliability.
Innovation Solution
A light-emitting element design featuring multiple insulating films, including an interlayer dielectric film with a high dielectric constant and thin thickness, surrounded by first and second element insulating films, to prevent surface defects and oxygen diffusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple insulating films are disposed directly on the side surface of the core, then surface defects are prevented and oxygen diffusion is blocked, but device complexity increases
Solution Approach 1:
The insulating film structure is divided into three distinct segments: an interlayer dielectric film directly on the core side surface, a first element insulating film surrounding the interlayer dielectric film, and a second element insulating film surrounding the first element insulating film. Each segment performs a specific function in preventing surface defects and blocking oxygen diffusion, resolving the contradiction by organizing complexity into functional segments.
Solution Approach 2:
The patent employs composite insulating film structures combining different materials with complementary properties. The interlayer dielectric film uses high dielectric constant materials for electrical isolation, while the element insulating films use materials with low oxygen permeability for barrier functions. This composite approach achieves enhanced reliability through material diversity while managing structural complexity.
2Reliability
If the interlayer dielectric film is made thin to reduce oxygen diffusion path, then oxygen ingress is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The interlayer dielectric film is applied specifically and directly on the side surface of the core where oxygen diffusion is most critical, rather than uniformly throughout. This localized application concentrates the oxygen barrier function where needed most, allowing thinner dimensions in critical areas while managing overall manufacturing precision requirements.
Solution Approach 2:
The patent uses composite insulating film structures where the interlayer dielectric film (thin, high-k material) works in conjunction with thicker element insulating films. This composite approach allows the thin interlayer film to provide oxygen barrier function at the critical core interface, while the element insulating films provide additional barrier capacity, distributing the manufacturing precision burden across multiple layers with different thickness requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves efficiency and reliability by minimizing surface defects and oxygen ingress, enhancing internal quantum efficiency and maintaining luminance over time.
Implementation Method 1
The interlayer dielectric film may include an oxide insulating material having a dielectric constant of about 10 or more
Implementation Method 2
multiple insulating films disposed directly on a side surface of a core including multiple semiconductor layers... to prevent surface defects and oxygen diffusion
Data Source
AI summary
A light-emitting element includes a core comprising a first semiconductor layer, a second semiconductor layer disposed on the first semiconductor layer, and an emissive layer disposed between the first semiconductor layer and the second semiconductor layer, an interlayer dielectric film surrounding a side surface of the core, a first element insulating film surrounding an outer surface of the interlayer dielectric film, and a second element insulating film surrounding an outer surface of the first element insulating film. The interlayer dielectric film includes an oxide insulating material having a dielectric constant of about 10 or more, and the interlayer dielectric film has a thickness of less than or equal to about 5 nm.