Light-emitting Element Module Lid Protrusion Heat Dissipation
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Solution Overview
Problem
Existing light-emitting element modules using Peltier devices face challenges in maintaining stable temperature under high ambient conditions, leading to variations in the wavelength of light emitted by semiconductor laser elements due to inadequate heat dissipation properties of the package.
Innovation Solution
A light-emitting element module design featuring a Peltier device, a semiconductor laser element, and a package with a base and lid configuration where the lid has a protrusion portion and a window, enhancing heat dissipation and maintaining a temperature difference between the lid and base to reduce heat radiation to the semiconductor laser element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the package uses a conventional base and lid structure, then the device is simple to manufacture, but the heat dissipation property is poor causing high package temperature
Solution Approach 1:
The lid is designed with a protrusion portion that extends in the thickness direction, transforming a two-dimensional flat structure into a three-dimensional structure with enhanced surface area. This dimensional change allows for improved heat dissipation without significantly complicating the manufacturing process, as the protrusion can be formed through standard molding techniques.
Solution Approach 2:
The lid is segmented into multiple functional regions: a main body portion, a protrusion portion extending from it, and a window formed in the protrusion. This segmentation allows each region to serve specific functions - the protrusion for heat dissipation, the window for light transmission - while maintaining overall structural integrity and manufacturability.
2Volume of moving object
If the window is positioned close to the semiconductor laser element, then the device size is reduced, but heat radiation from the window to the element increases causing wavelength variation
Solution Approach 1:
The protrusion portion acts as an intermediary structure between the window and the semiconductor laser element. By forming the window in the protrusion rather than directly in the lid body, the design creates an intermediate thermal barrier that reduces heat radiation from the window to the element, while the overall compact structure maintains small device size.
Solution Approach 2:
The lid structure exhibits local quality differentiation where the protrusion portion containing the window has different thermal and optical properties compared to the main body. The window region is optimized for light transmission while the protrusion structure provides thermal management, allowing the system to meet both optical and thermal requirements in a compact form.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces temperature variations in the semiconductor laser element, minimizing wavelength fluctuations and improving the reliability of light-emitting element modules even under high-temperature conditions.
Implementation Method 1
an electronic thermo-element (Peltier device) using the Peltier effect
Implementation Method 2
the temperature of the package is considerably increased due to radiation of heat from the package
Data Source
AI summary
A light-emitting element module includes: a Peltier device; a light-emitting element that is disposed on the Peltier device; and a package that accommodates the Peltier device and the light-emitting element, the package including a base on which the Peltier device is disposed and a lid joined to the base and. When Ts is external temperature of the package, Tv is temperature of the light-emitting element, Tc1 is temperature of the base, and Tc2 is temperature of the lid, Ts<Tc2<Tc1 is satisfied in a case of Tv<Ts.