Light-emitting Module with Alternating LED Mounting
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Solution Overview
Problem
The existing light-emitting devices require high accuracy in mounting LED elements, which is challenging and costly, especially when flip-chip mounting is involved, leading to increased manufacturing complexity and potential misalignment issues.
Innovation Solution
A light-emitting module design featuring a light-guiding plate with recesses for mounting light-emitting elements, where first and second light-emitting elements with different emission characteristics are alternately mounted, and connected by first and second wiring formed on the surface, allowing for reduced mounting accuracy requirements and improved light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flip-chip mounting is used to connect LED elements, then electrical connection is achieved, but mounting accuracy requirement increases significantly
Solution Approach 1:
Instead of mounting LED chips directly onto wiring electrodes (conventional flip-chip method), the patent inverts the approach by mounting LED chips onto a light-guiding plate first, then mounting the entire LED unit onto the board. This reversal eliminates the need for precise alignment between chip electrodes and board wiring electrodes, thereby reducing mounting accuracy requirements while maintaining reliable electrical connection.
Solution Approach 2:
The patent introduces a light-guiding plate as an intermediary component between the LED chips and the board wiring electrodes. The light-guiding plate serves as a mounting substrate that simplifies the mounting process, while electrical connection is achieved through conductive adhesive or wire bonding from the chip electrodes to the board wiring electrodes, rather than direct flip-chip mounting. This intermediary approach reduces the stringency of mounting accuracy requirements.
2Reliability
If wiring electrodes pass through between anode and cathode electrodes of second LED element, then series connection is achieved, but mounting accuracy requirement increases
Solution Approach 1:
The patent inverts the conventional approach by not requiring wiring electrodes to pass through between the anode and cathode electrodes of the second LED element. Instead, the light-guiding plate structure and alternative wiring methods (conductive adhesive or wire bonding) eliminate this complex routing requirement, thereby reducing mounting accuracy requirements while achieving reliable series connection between first and second LED elements.
3Loss of energy
If light-emitting elements are mounted with high accuracy, then light extraction efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the light-guiding plate at positions that automatically accommodate the LED chips. When LED chips are mounted in these recesses, they are automatically positioned at optimal locations for light extraction, eliminating the need for high-precision mounting while maintaining light extraction efficiency. This preliminary structuring of the light-guiding plate simplifies the manufacturing process.
Solution Approach 2:
The patent changes the structural parameters of the light-guiding plate by incorporating recesses with specific dimensions and positions. These recesses are designed to automatically position LED chips at optimal distances from the light extraction surface, thereby maintaining light extraction efficiency without requiring high mounting accuracy. This parameter optimization reduces manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design relaxes the need for precise mounting, reduces manufacturing complexity, and enhances light extraction efficiency by alternately arranging light-emitting elements and forming connections on the surface, resulting in a more cost-effective and accurate light-emitting module with reduced unevenness in luminance.
Implementation Method 1
a light-guiding plate having a light-extracting surface
Implementation Method 2
a light-reflective member covering each of the first light-emitting elements and each of the second light-emitting elements
Data Source
AI summary
A light-emitting module includes a light-guiding plate having a light-extracting surface, a plurality of first light-emitting elements and a plurality of second light-emitting elements having a light-emission characteristic different from a light-emission characteristic of the first light-emitting elements, the first light-emitting elements and the second light-emitting elements being alternately mounted on a surface of the light-guiding plate opposite to the light-extracting surface, with electrodes facing a direction opposite to the light-extracting surface of the light-guiding plate, a light-reflective member covering each of the first light-emitting elements and each of the second light-emitting elements to expose electrodes of each of the first light-emitting elements and electrodes of each of the second light-emitting elements from a first surface, first wiring formed on the first surface to connect the electrodes of the first light-emitting elements, and second wiring formed on the first surface to connect the electrodes of the second light-emitting elements.