Light-emitting Module Bezel and PCB Heat Dissipation
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Solution Overview
Problem
Conventional light-emitting modules, such as organic EL modules, face issues with substrate protection, orientation flexibility, cost-effectiveness, heat dissipation, and reliability, particularly due to complex assembly requirements and inadequate heat management.
Innovation Solution
A light-emitting module design featuring a bezel with fold-in parts for edge protection, a full-metal layer printed circuit board for uniform heat and light distribution, and through holes for enhanced heat dissipation, allowing for cost-effective assembly and installation in any orientation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional housing structure is provided to protect the substrate edges, then safety is improved, but the module thickness increases and the thin characteristic is lost
Solution Approach 1:
The patent integrates the protective housing structure within the existing module boundaries by nesting the substrate edge protection mechanism inside the housing. The housing's internal structure is designed to accommodate the substrate while providing edge protection, effectively placing one functional element (protection) within another (housing) without increasing overall module thickness.
Solution Approach 2:
The patent employs thin film structures and flexible protective layers at the substrate edges. Instead of using bulky rigid protectors, thin film coatings or flexible protective sheets are applied directly to the substrate edges, providing injury prevention while maintaining the thin profile of the overall module.
2Temperature
If elaborate works are performed for the second electrode contact to improve heat dissipation, then heat management is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines the second electrode contact function with the existing housing structure. Instead of adding separate elaborate contact mechanisms, the housing itself is designed to provide both structural support and electrical contact functionality, merging multiple functions into a single integrated component that simplifies manufacturing.
Solution Approach 2:
The housing structure is designed to serve multiple functions simultaneously: it provides mechanical protection, structural support, thermal management, and electrical contact. This multi-functional design eliminates the need for separate elaborate components for each function, reducing manufacturing complexity while maintaining effective heat dissipation.
3Temperature
If accuracy in assembly is required for the second electrode contact, then heat dissipation is improved, but assembly difficulty and manufacturing cost increase
Solution Approach 1:
The patent incorporates tolerance compensation features and alignment guides in the housing design that anticipate and accommodate assembly variations. By designing the contact structure with built-in alignment features and tolerance buffers, the system maintains effective thermal contact even with normal assembly variations, eliminating the need for high-precision assembly procedures.
4Length of stationary object
If the light-emitting module is designed to be thin and lightweight, then the planar light-emitting characteristic is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent replaces traditional bulky mechanical heat sinks with thin-film thermal management structures. By using thermally conductive films and optimized heat pathways integrated into the thin module structure, effective heat dissipation is achieved without adding significant thickness, substituting conventional thermal management approaches with thin-film technology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a thin, lightweight, and reliable light-emitting module with improved heat dissipation and uniform luminance distribution, ensuring long-term performance and safety while reducing manufacturing costs.
Implementation Method 1
the printed circuit board includes: a base substrate; a tile-side metal layer on a planar light-emitting tile side of the base substrate; and a plurality of through holes connecting the tile-side metal layer to an other surface side of the base substrate
Implementation Method 2
a plurality of through holes connecting the tile-side metal layer to an other surface side of the base substrate
Data Source
AI summary
To provide, in a simple and cost-effective manner, a planar light-emitting module with reduced thickness as a whole, with its substrate end ensuring shock resistance and low risk of injury, and being excellent in transferring and dissipating heat. A light-emitting module of the present invention includes: a bezel having a leg part having an inner height H; a planar light-emitting tile; and a printed circuit board having a plurality of heat dissipating through holes. A heat dissipating interval is provided between the printed circuit board and the mounted surface. The printed circuit board includes a tile-side main surface being a soaking metal layer including through hole openings.