Light-Emitting Module Heat Dissipation Member Design

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Solution Overview

Problem

Light-emitting modules, particularly in vehicle lamps, face challenges in heat dissipation due to increased light emission density, leading to reliability issues.

Innovation Solution

A light-emitting module design incorporating a graphite member with grooves and a metal member, where the graphite member has high thermal conductivity in specific directions and low thermal conductivity in others, bonded to both the supporting substrate and the wiring substrate using sintered metal layers, enhancing heat dissipation and thermal shock resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If light-emitting elements are mounted at high density to increase light emission amount, then illumination intensity is improved, but heat generation increases leading to reliability deterioration

Engineering Contradiction:
Improvelight emission amountVSAvoidheat management reliability
Core Design Contradiction:
Illumination intensityVSReliability

Solution Approach 1:

The heat dissipation member is constructed as a composite material comprising a graphite member and a metal member. The graphite member provides high thermal conductivity in the vertical direction (along the stacking direction of graphene sheets) to efficiently conduct heat away from the light-emitting elements, while the metal member provides high thermal conductivity in the horizontal direction to distribute heat laterally. This composite structure enables effective heat dissipation in multiple directions simultaneously, resolving the contradiction between high-density mounting (which increases heat generation) and reliability (which requires effective heat management).

Inventive Principle:
Principle #40Composite materials

2Stability of the object's composition

If substrates with different thermal expansion coefficients are bonded together, then structural integration is improved, but thermal stress increases leading to reliability deterioration

Engineering Contradiction:
Improvesubstrate integrationVSAvoidthermal shock resistance
Core Design Contradiction:
Stability of the object's compositionVSReliability

Solution Approach 1:

The heat dissipation member acts as an intermediary component between the first substrate and the second substrate. It is bonded to both substrates using sintered metal layers, creating a thermal management interface that accommodates differences in thermal expansion coefficients. The graphite member's unique thermal properties and the metal member's ductility allow this intermediary structure to absorb thermal stresses, preventing direct stress transmission between the substrates with different expansion characteristics, thus maintaining both integration and reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If a simple heat dissipation structure is used, then device complexity is reduced, but heat dissipation efficiency deteriorates

Engineering Contradiction:
Improveheat dissipation structure complexityVSAvoidheat dissipation efficiency
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The heat dissipation member introduces a vertical dimension to heat dissipation through the graphite member's stacking structure. The graphene sheets are stacked in layers with high thermal conductivity along the stacking direction, creating a three-dimensional heat conduction pathway. This vertical heat dissipation path complements the horizontal heat distribution provided by the metal member, achieving efficient heat management in multiple dimensions without requiring an overly complex structure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively dissipates heat generated by light-emitting elements, reduces thermal stress between substrates with different expansion coefficients, and improves the reliability of light-emitting modules and vehicle lamps by ensuring efficient heat management and thermal shock resistance.

Implementation Method 1

The graphite member has high thermal conductivity in specific directions and low thermal conductivity in others

Methodology Applied
Scientific EffectThermal conductivity: Conduction (thermal)

Implementation Method 2

bonded to both the supporting substrate and the wiring substrate using sintered metal layers

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS11725796B2Light-emitting module, vehicle lamp, and heat dissipation member
Publication Date: 2023.08.15 NICHIA CORP
  • US11725796B2 patent drawing
  • US11725796B2 patent drawing
  • US11725796B2 patent drawing

AI summary

A light-emitting module includes a first substrate, a heat dissipation member, a second substrate, and a light-emitting element. The heat dissipation member is disposed on the first substrate. The second substrate is disposed on the heat dissipation member. The light-emitting element is disposed on a lower surface of the first substrate or an upper surface of the second substrate. The heat dissipation member includes a graphite member and a metal member. The graphite member has a first surface facing the first substrate and a second surface located opposite to the first surface. The graphite member has a first groove extending in a first direction in the first surface. The metal member includes a first internal metal member disposed in the first groove.