Light-Emitting Module Manufacturing Precision
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Solution Overview
Problem
Existing methods for manufacturing light-emitting modules, particularly for 3D printers, face challenges in accurately arranging multiple light-emitting elements at narrow intervals, leading to inefficiencies and reduced yield due to poor work efficiency and high defect rates.
Innovation Solution
A method involving the arrangement of light-emitting element arrays on a substrate with adjacent arrays in contact, using positioning portions and connectors to ensure precise alignment and mounting, allowing for accurate placement of light-emitting elements at predetermined intervals, such as 10 μm to 50 μm apart.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If light-emitting elements are arranged at narrow intervals to improve definition, then manufacturing precision is improved, but work efficiency deteriorates due to complex arrangement processes
Solution Approach 1:
The light-emitting element array is divided into multiple chips, each containing a plurality of light-emitting elements. These chips are arranged in a staggered configuration on the substrate, allowing for precise positioning at narrow intervals while simplifying the overall manufacturing process through modular assembly
Solution Approach 2:
Multiple light-emitting elements are pre-formed on each chip before mounting on the substrate. This preliminary arrangement on chips enables subsequent easy and efficient mounting on the substrate at predetermined narrow intervals, improving both precision and productivity
2Manufacturing precision
If light-emitting elements are arranged at narrow intervals to improve definition, then manufacturing precision is improved, but defect rate increases due to difficulty in accurate arrangement
Solution Approach 1:
Dividing the array into multiple chips with staggered arrangement reduces the complexity of arranging individual elements at narrow intervals, thereby reducing positioning errors and defects while maintaining high precision
Solution Approach 2:
Chips serve as intermediary carriers that pre-house multiple light-emitting elements. These chips act as modular units that simplify the mounting process on the substrate, reducing direct handling of individual elements and thereby reducing defects while enabling precise narrow-interval arrangement
Data Source
AI summary
To provide a method of manufacturing a light-emitting module capable of accurately arranging a plurality of light-emitting elements at narrow intervals, and a light-emitting module manufactured by the method of manufacturing, and, moreover, a device on which the light-emitting module is mounted. Provided is a method of manufacturing a light-emitting module including: a plurality of light-emitting element arrays each including, in a plane parallel to resonator length of a light-emitting element, a plurality of the light-emitting elements arranged along a width direction perpendicular to a direction of the resonator length; and a substrate on which the plurality of light-emitting element arrays is mounted, the method including arranging the plurality of light-emitting elements on the substrate at predetermined intervals along the width direction in the light-emitting module, by causing side surfaces of the respective light-emitting element arrays adjacent to each other along the width direction to be in contact with each other and mounting the respective light-emitting element arrays on the substrate.