Light-emitting Module Mesh Conductor Boundary
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Solution Overview
Problem
Conventional wire bonding methods are not suitable for mounting LED chips on flexible substrates, leading to variations in light transmittance and appearance due to conductor patterns on light transmissive substrates, which affect the efficiency and aesthetics of light-emitting modules.
Innovation Solution
A light-emitting module with a mesh pattern conductor layer on light transmissive films, where the end portions of adjacent mesh patterns project alternately along boundaries, creating a zigzag shape that disperses high transmittance regions and makes the boundary of the mesh patterns unnoticeable, ensuring both flexibility and light transmissive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductor patterns are disposed on the light transmissive substrate to supply electric power to the LED chip, then electrical connection is improved, but light transmittance varies and appearance limpidity is lost
Solution Approach 1:
The conductor pattern is segmented into multiple isolated conductor islands instead of continuous patterns. Each conductor island is electrically connected to the LED chip through conductive paste, eliminating the need for wire bonding while maintaining electrical connection reliability. This segmentation prevents the formation of visible lines and boundaries, ensuring uniform light transmittance across the module.
2Reliability
If wire bonding method is used to mount LED chip, then electrical connection is reliable, but it is not suitable for flexible substrates and reduces flexibility
Solution Approach 1:
The wire bonding process is completely extracted and eliminated from the mounting process. Instead of using wires to connect the LED chip to the substrate, the patent uses conductive paste to directly electrically connect the chip electrodes to the conductor islands formed on the flexible substrate. This extraction enables the use of flexible substrates while maintaining reliable electrical connections.
3Reliability
If gapless conductor patterns are disposed on the substrate, then electrical connection is improved, but lines along outer edges stand out and appearance limpidity is lost
Solution Approach 1:
The conductor pattern is designed with different local characteristics: conductor islands with varying sizes and shapes are distributed across the substrate, with each island optimized for its specific location. The conductor islands near the LED chip have appropriate dimensions for electrical connection, while their distribution and sizing create uniform light transmittance in the display area. This local optimization ensures both electrical reliability and appearance uniformity.
Data Source
AI summary
A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.