Light Emitting Module with Overlapping Conductive Layer
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Solution Overview
Problem
Existing light emitting modules face challenges in achieving uniform luminance due to differences in electric resistance across various light emitting devices, leading to uneven current supply and luminance output.
Innovation Solution
The implementation of a light emitting module design that includes a first terminal part, a first and second light emitting device, a first conductive thin film, and a first conductive layer, where the first conductive layer is strategically positioned to overlap with the first thin film region, reducing the difference in electric resistance by acting as auxiliary wiring and facilitating even current distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional light emitting module design is used, then device complexity is low, but luminance uniformity deteriorates due to different current path lengths causing different electric resistances
Solution Approach 1:
The patent introduces a conductive layer in the vertical dimension (thickness direction) to overlap with the conductive thin film, transforming a two-dimensional planar connection into a three-dimensional structure. This dimensional addition allows current to flow through multiple paths simultaneously, equalizing electric resistance without complicating the horizontal layout
Solution Approach 2:
The conductive layer is strategically positioned to overlap specifically with regions having different current path lengths. By applying additional conductivity locally where needed, the patent compensates for resistance differences in specific areas while leaving other regions unchanged, achieving uniform current distribution through localized modification
2Manufacturing precision
If conventional design without overlapping conductive layer is used, then manufacturing process is simple, but electric resistance difference between devices increases
Solution Approach 1:
The conductive layer is formed in advance during the manufacturing process to pre-compensate for resistance differences before final assembly. By establishing the overlapping conductive structure beforehand, the patent ensures uniform electric resistance is built into the module design, simplifying subsequent manufacturing steps
3Manufacturing precision
If current path lengths are made equal for all devices, then electric resistance uniformity improves, but module area increases
Solution Approach 1:
Instead of extending current paths horizontally to equalize lengths, the patent adds a vertical dimension by stacking the conductive layer over the thin film. This allows current to travel through multiple parallel paths in the thickness direction, achieving resistance uniformity without increasing the horizontal footprint of the module
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances luminance uniformity by reducing the difference in electric resistance and current supply to each light emitting device, resulting in improved uniformity and efficiency while also allowing for a more compact module size.
Implementation Method 1
The first conductive layer is electrically connected to the first thin film region. At least a portion of the first conductive layer overlaps with the first thin film region in a first direction that is perpendicular to a plane in which the first thin film region extends.
Data Source
AI summary
A light emitting module includes a first terminal part, a first light emitting device including a first electrode, a second light emitting device including a second electrode, a first conductive thin film including a first thin film region and a second thin film region, and a first conductive layer electrically connected to the first thin film region. The first thin film region electrically connects the first terminal part and the first electrode, and has a first current path length. The second thin film region electrically connects the first terminal part and the second electrode, and has a second current path length shorter than the first current path length. At least a portion of the first conductive layer overlaps with the first thin film region in a first direction that is perpendicular to a plane in which the first thin film region extends.