Light-Emitting Module Bonding With Corrosion-Resistant Plating
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Solution Overview
Problem
Existing light-emitting modules face challenges in achieving high reliability due to issues with bonding and corrosion of electrodes, which affect the module's performance and durability.
Innovation Solution
A method involving a wiring substrate with a metal layer, a resist layer, and an intermediate body with a light-emitting element and covering layers, where bonding members are formed by plating to connect the electrode and metal layer, and a plating layer is added to enhance bonding and protect against corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a bonding member is formed by plating to connect the electrode and metal layer, then bonding strength is improved, but corrosion resistance deteriorates
Solution Approach 1:
The bonding member is constructed as a composite structure with a base material (e.g., copper) providing excellent bonding strength and electrical conductivity, and a plating layer (e.g., nickel or gold) providing corrosion resistance. This composite material approach allows simultaneous achievement of strong bonding and corrosion protection.
Solution Approach 2:
The plating process modifies the surface parameters of the bonding member by depositing a protective layer with different chemical composition and properties. This changes the surface characteristics to resist corrosion while maintaining the bulk material's bonding properties.
2Reliability
If a plating layer is added to protect against corrosion, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The formation of the plating layer is merged with the bonding member fabrication process. The plating is applied directly during the same manufacturing sequence when the bonding member is being formed, combining two operations (bonding member creation and corrosion protection) into one integrated process.
Solution Approach 2:
The plating layer is formed in advance as part of the bonding member creation process, before the bonding member is assembled into the final device. This preliminary action ensures corrosion protection is built-in from the start rather than added as a separate post-processing step.
3Strength
If the bonding member is grown by plating from the metal layer, then bonding strength is improved, but heat dissipation deteriorates
Solution Approach 1:
The thickness of the plating layer is carefully controlled to maintain thermal conductivity. By optimizing the plating layer thickness parameter, the balance between corrosion protection and heat dissipation is achieved, ensuring the plating layer does not significantly impede thermal flow while providing adequate corrosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a highly reliable light-emitting module with improved bonding strength and corrosion resistance, enhancing heat dissipation and light extraction efficiency.
Implementation Method 1
forming, by plating, a bonding member by growing the bonding member starting from the metal layer in a manner that the bonding member is in contact with the electrode and the covering layer
Implementation Method 2
forming a plating layer on a surface of the bonding member by plating. The plating layer is disposed between the electrode surface of the light-emitting element and the bonding member
Data Source
AI summary
A method for manufacturing a light-emitting module includes: providing a wiring substrate including: a base member having an upper surface, and a metal layer disposed on the upper surface of the base member; forming a resist layer on the wiring substrate such that the metal layer is exposed from the resist layer; disposing an intermediate body on the resist layer, the intermediate body comprising a light-emitting element and a covering layer; forming a bonding member; removing the resist layer and the covering layer; and forming a plating layer on a surface of the bonding member by plating, such that a portion of the plating layer is located between an electrode surface of the light-emitting element and the bonding member.