Light-emitting Module With Optical Reflection Layer
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Solution Overview
Problem
Conventional light-emitting modules, particularly in large-sized LCDs, face challenges in low light-emitting efficiency, significant light absorption, and high production costs due to non-directional light emission and limited heat-dissipating efficiency, which hinder their suitability for large-sized TV panels.
Innovation Solution
A light-emitting module with a flexible or rigid substrate featuring a light-emitting device and an optical reflection layer that reflects and diffuses light to enhance front light-emitting efficiency and heat-dissipating capabilities, integrated with thermal conductive materials and micro lenses for improved light uniformity and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If conventional edge-emitting LED structure is used to reduce display thickness, then the display thickness is reduced, but the light-emitting efficiency becomes relatively low
Solution Approach 1:
The patent transitions from conventional edge-emitting LED structure to a bottom-emitting LED structure where light is emitted perpendicular to the substrate surface. This dimensional change in light emission direction enables better light extraction and higher light-emitting efficiency while maintaining thin display profile through optimized optical path design
2Loss of energy
If substrate transfer technique or mirror layer coating is applied to improve light-emitting efficiency, then light absorption is reduced, but the structure complexity and manufacturing difficulty increase
Solution Approach 1:
The patent utilizes the substrate's own back surface as a reflective surface by designing the LED structure to emit light downward toward the substrate back surface, which then reflects light upward through the substrate. This converts the substrate's optical properties into a beneficial reflective mechanism, eliminating the need for additional mirror layers while improving light extraction efficiency
Solution Approach 2:
The substrate serves multiple functions: as the mechanical support for the LED chip, as the optical waveguide for light transmission, and as the reflective surface for light extraction. This multi-functionality simplifies the overall structure by eliminating the need for separate mirror layers or complex substrate transfer processes
3Temperature
If thermal substrate or thermal paste is used to improve heat-dissipating efficiency, then heat dissipation is enhanced, but the heat-dissipating efficiency remains limited
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent heat dissipation chambers formed within the substrate. Each chamber provides a separate thermal pathway from the LED chip to the substrate back surface, increasing the effective heat dissipation area and improving thermal management efficiency through distributed heat extraction
4Area of stationary object
If large sized luminescent panel is manually arranged in array, then the display size is achieved, but productivity becomes low and labor cost increases
Solution Approach 1:
The patent integrates multiple LED chips and their respective heat dissipation structures into a single monolithic substrate platform. This allows simultaneous mounting and wiring of multiple LEDs in an array configuration during automated manufacturing processes, eliminating the need for manual assembly of individual LED modules and significantly improving productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly boosts light-emitting efficiency and heat-dissipating performance, enabling a flexible and efficient backlight source for large-sized displays with improved light uniformity and reduced production costs.
Implementation Method 1
an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light
Implementation Method 2
integrated with thermal conductive materials for improved light uniformity and productivity
Data Source
AI summary
A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.