Light-emitting Module Resin Substrate Wiring Integration
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Solution Overview
Problem
The existing light-emitting module with an electric power feeding attachment featuring bus-bars is complex and costly to manufacture, necessitating a simpler and cost-effective configuration.
Innovation Solution
A light-emitting module comprising a semiconductor light-emitting element, a resin substrate circuit board with internal wiring, and an element metal plate, where the semiconductor element is directly mounted on the metal plate and connected via metal wires, allowing for a simplified configuration and reduced material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an electric power feeding attachment with embedded bus-bars is used to connect the driver unit and light-emitting diode, then electrical connection is achieved, but the device complexity and manufacturing cost increase due to multiple components and insert molding process
Solution Approach 1:
The patent merges the electric power feeding attachment and the circuit board into a single integrated circuit board structure. The wiring portion is formed by laminating copper foils onto the resin substrate, eliminating the need for separate bus-bars and insert molding process. This integration reduces the number of components while maintaining reliable electrical connection between the light-emitting element and control circuit.
2Reliability
If an electric power feeding attachment with embedded bus-bars is used, then electrical connection is achieved, but manufacturing cost increases due to complex insert molding process and multiple components
Solution Approach 1:
The patent combines multiple components into a single circuit board where the wiring portion is created by laminating copper foils onto a resin substrate. This eliminates the complex insert molding process required for embedding bus-bars, significantly simplifying manufacturing and reducing costs while maintaining reliable electrical connections.
Solution Approach 2:
The patent changes the manufacturing approach from insert molding with embedded bus-bars to a lamination process where copper foils are bonded to the resin substrate surface and internally. This parameter change in the manufacturing method simplifies the process and reduces costs while achieving the same electrical connection function.
3Reliability
If a thick electric power feeding attachment with embedded bus-bars is used, then electrical connection is achieved, but the overall module thickness increases
Solution Approach 1:
The patent uses thin copper foil layers laminated onto the resin substrate to create the wiring portion, replacing the thick bus-bar structure. This copying of the electrical connection function using a different, thinner material approach reduces the overall module thickness while maintaining reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances connection reliability, reduces manufacturing costs, and provides flexibility in heat management and layout, enabling a thinner and more cost-effective light-emitting module.
Implementation Method 1
The semiconductor light-emitting element may be connected to the wiring portion via a metal wire such as a gold wire, an aluminum wire or an aluminum ribbon
Implementation Method 2
an element metal plate on which the semiconductor light-emitting element is mounted
Data Source
AI summary
A light-emitting module includes: a semiconductor light-emitting element; a circuit board on which a lighting control circuit configured to perform control to turn on and off the semiconductor light-emitting element is provided; and an element metal plate on which the semiconductor light-emitting element is mounted. The circuit board is a resin substrate in which a wiring portion connecting the semiconductor light-emitting element and the lighting control circuit is provided.