Light-emitting Module Stepped Portion Thickness Reduction
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Solution Overview
Problem
The existing light-emitting modules have limitations in reducing thickness while maintaining reliability, which restricts the miniaturization of display apparatuses due to the height of protecting materials and encapsulation portions around LEDs.
Innovation Solution
A light-emitting module design featuring a printed circuit board with a hole for a stepped portion of the light emitting package, where the stepped portion's height matches the total thickness of the lead and PCB, allowing for uniform protecting material thickness and enhanced protection of the light source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the height of the protecting material and encapsulation portion is decreased, then the thickness of the light-emitting module is reduced, but the reliability of the LED is degraded
Solution Approach 1:
The patent introduces a stepped portion that creates a vertical dimension variation within the protecting material structure. This stepped configuration allows the protecting material to have different heights at different locations, enabling the overall module thickness to be reduced while maintaining sufficient protection height at critical areas around the LED chip.
Solution Approach 2:
The protecting material is designed with non-uniform height distribution through the stepped portion. The higher region provides enhanced protection where needed (around the LED chip), while the lower region reduces overall thickness. This local differentiation of quality allows simultaneous optimization of both protection reliability and thickness reduction.
2Length of moving object
If the thickness of the light-emitting module is decreased, then the bezel of the display apparatus is reduced, but the protecting material thickness becomes non-uniform
Solution Approach 1:
By introducing the stepped portion with varying heights, the patent transforms the protecting material from a uniform single-layer structure to a multi-level structure. This dimensional variation enables the module to achieve reduced overall thickness while maintaining adequate protecting material thickness at critical locations, thus resolving the conflict between thickness reduction and manufacturing precision.
Data Source
AI summary
A light-emitting module includes a printed circuit board (PCB) and a light emitting package. A hole is formed through the PCB. The light emitting package has a light source and a lead, and is disposed on the PCB. The light emitting package has a stepped portion having predetermined height. The stepped portion is disposed in the hole formed through the PCB. Thus, a thickness of the light-emitting module may be decreased, reliability of the light-emitting module may be enhanced, and thus a thickness and a bezel of a display apparatus may be decreased.