Light-Emitting Module With Through-Hole Lightguide Plate
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Solution Overview
Problem
Existing light-emitting modules have limitations in reducing thickness while maintaining effective light extraction and electrical connectivity, which affects their integration in thin-form-factor displays like liquid crystal display devices.
Innovation Solution
A method involving a lightguide plate with through holes, light modulating members, bonding members, and an interconnect layer is used to equalize heights and secure light sources with electrodes, allowing for reduced thickness and efficient light extraction, along with electrical coupling for power distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional light-emitting module structures are used, then electrical connectivity and light extraction can be maintained, but the module thickness cannot be reduced
Solution Approach 1:
The patent transitions from planar electrode arrangements to a three-dimensional vertical stacking architecture. Multiple light sources and bonding members are stacked in the thickness direction, with electrodes extending vertically to provide electrical connectivity through the stacked layers. This dimensional change enables thickness reduction while maintaining electrical pathways.
Solution Approach 2:
The patent implements nested positioning where light sources are placed within recesses of bonding members, and bonding members are positioned within recesses of lightguide plates. This nested arrangement allows components to be tightly integrated vertically, reducing overall module thickness while maintaining proper electrical and optical connections.
2Length of moving object
If conventional light-emitting module structures are used, then electrical connectivity can be maintained, but the module thickness cannot be reduced
Solution Approach 1:
The module is segmented into discrete stacked layers including lightguide plates, bonding members, and light sources. Each layer is independently formed with specific functions, allowing the overall structure to be reduced in thickness while maintaining complexity through vertical integration of these segmented components.
Solution Approach 2:
Multiple functional components are merged into a compact vertical stack. The bonding members simultaneously provide mechanical bonding, electrical connectivity through extended electrodes, and structural support for nesting light sources. This merging of functions into vertically integrated components reduces overall module thickness.
3Reliability
If light sources are positioned with electrodes facing light modulating members, then electrical connectivity is improved, but light extraction efficiency decreases
Solution Approach 1:
The light sources are positioned asymmetrically within recesses of bonding members, with electrodes extending in one direction (vertical) while light emission occurs in another direction (toward lightguide plate). This asymmetric positioning allows electrodes to face away from light modulating members, simultaneously achieving good electrical connectivity and optimal light extraction efficiency.
Data Source
AI summary
A light-emitting module manufacturing method of the present disclosure includes: providing a plurality of light sources each including a semiconductor layered structure and an electrode; providing a lightguide plate having a first principal surface to serve as a light extraction surface, a second principal surface opposite to the first principal surface, and a plurality of through holes penetrating through the lightguide plate from the first principal surface to the second principal surface; providing a light modulating member in each of the through holes; providing a plurality of bonding members on the light modulating member; equalizing heights of upper surfaces of the plurality of bonding members; placing the light sources on the bonding members such that the electrode faces away from the light modulating member; providing a cover member so as to cover the second principal surface; and forming an interconnect layer electrically coupled with the light sources.