Light Emitting Module Wiring Segments and Reflective Members
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Solution Overview
Problem
Conventional light emitting modules face challenges in achieving high connection reliability due to the miniaturization of semiconductor elements, leading to difficulties in packaging density and reliability of connections between light emitting elements and electrodes.
Innovation Solution
A method for manufacturing a light emitting module involves placing light emitting devices with metal films and first light reflective members on a light guide plate, forming a second light reflective member in gaps between the devices, and creating wiring segments that connect to the metal films, ensuring high connection reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If light emitting devices are miniaturized to increase packaging density, then the size of light emitting elements is reduced, but connection reliability between light emitting elements and electrodes deteriorates
Solution Approach 1:
The patent segments the connection structure into multiple functional layers: metal films on electrodes, first light reflective members covering lateral surfaces, and second light reflective members filling gaps between devices. This segmentation allows each component to be optimized independently, maintaining connection reliability while enabling miniaturization through efficient space utilization.
Solution Approach 2:
The patent implements a nested structure where the first light reflective member is positioned within the encapsulating resin covering the light emitting element, and the second light reflective member fills the gaps between adjacent light emitting devices. This nested arrangement maximizes packaging density by utilizing all available space without compromising connection integrity.
2Length of moving object
If metal films are extended to lateral sides to reduce thickness, then the module thickness is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the metal films on the electrodes and extending them to the lateral sides of the light emitting elements before applying the encapsulating resin. This preliminary positioning of conductive elements simplifies subsequent manufacturing steps, as the electrical connections are already established and protected by the resin encapsulation.
Solution Approach 2:
The patent utilizes thin film structures for the metal films and light reflective members, which can be deposited as conformal layers over the light emitting elements. These thin films reduce overall module thickness while maintaining electrical and optical functionality, and can be manufactured using standard thin-film deposition techniques.
3Illumination intensity
If gaps between light emitting elements are filled with reflective material, then light extraction efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The second light reflective member serves multiple functions: it fills the gaps between light emitting devices to improve light extraction efficiency, provides a bonding surface for the encapsulating resin, and creates a planar upper surface for subsequent wiring formation. This multi-functionality reduces the need for separate manufacturing steps and relaxes precision requirements.
Solution Approach 2:
The second light reflective member is designed to be self-aligning, where its placement in the gaps between light emitting devices automatically provides the necessary light reflection and structural support. The material itself serves as both the reflective element and the bonding substrate, eliminating the need for separate precision-aligned components.
Data Source
AI summary
A method for manufacturing a light emitting module includes: providing light emitting devices each including a light emitting element having an upper surface, a lateral surface, and an electrode positioned on the upper surface, a first light reflective member arranged on the lateral surface of the light emitting element, and a metal film formed on upper surfaces of the electrode and the first light reflective member; placing the light emitting devices on a light guide plate with gaps between the light emitting devices, with the metal films of the light emitting devices facing upward; forming masks respectively covering the metal films; forming a second light reflective member in the gaps between the light emitting devices on the light guide plate; removing the masks; and forming, on the light emitting devices and on the second light reflective member, wiring segments that connect to the metal films.