Light-Emitting Element Insulating Stack for Oxygen Damage Control
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Solution Overview
Problem
Existing light emitting elements face reliability issues due to damage to the active layer, primarily caused by oxygen penetration, which affects their performance and longevity.
Innovation Solution
The proposed solution involves a light emitting element structure with a specific configuration of insulating films, where the bond dissociation energy of the second insulating film is lower than that of the first and third insulating films, minimizing damage to the active layer and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single insulating film is used to surround the light emitting element, then the structure is simple, but oxygen penetration damages the active layer reducing reliability
Solution Approach 1:
The insulating film is divided into multiple separate insulating films (first insulating film, second insulating film, third insulating film) with different bond dissociation energies. Each film serves a specific protective function, with the second film acting as a sacrificial layer that releases oxygen to prevent penetration into the active layer, while the outer films provide structural integrity and oxygen barrier properties.
Solution Approach 2:
The patent uses a composite structure of multiple insulating films with different material properties. The first insulating film has high bond dissociation energy (7.0-9.0 eV) for structural stability, the second insulating film has lower bond dissociation energy (6.0-8.5 eV) to serve as an oxygen source, and the third insulating film has high bond dissociation energy (7.0-9.0 eV) for external protection. This composite approach solves the contradiction by combining materials with complementary properties.
2Reliability
If the bond dissociation energy of all insulating films is high, then structural stability is good, but oxygen penetration damages the active layer
Solution Approach 1:
Different regions of the insulating film structure have different bond dissociation energies tailored to their specific functions. The second insulating film located adjacent to the active layer has lower bond dissociation energy (6.0-8.5 eV) to facilitate oxygen release and prevent oxygen penetration, while the first and third insulating films have higher bond dissociation energy (7.0-9.0 eV) to maintain structural stability and provide external protection.
3Reliability
If the thickness of the insulating film is increased, then protection against oxygen penetration is improved, but manufacturing precision requirements increase
Solution Approach 1:
Instead of using a single thick insulating film that would require high manufacturing precision to control thickness uniformly, the patent segments the insulating function into multiple thinner films. The first insulating film thickness is 1-5 nm, the second insulating film thickness is 1-3 nm, and the third insulating film thickness is 1-5 nm. This segmentation reduces the cumulative thickness while maintaining protective function and lowers manufacturing precision requirements for each individual layer.
Data Source
AI summary
A light emitting element that includes a first semiconductor layer; a second semiconductor layer disposed on the first semiconductor layer; an active layer disposed between the first semiconductor layer and the second semiconductor layer; a first insulating film at least partially surrounding the first semiconductor layer, the second semiconductor layer, and the active layer; a second insulating film surrounding the first insulating film; and a third insulating film surrounding the second insulating film, wherein a bond dissociation energy of the second insulating film may be less than each of a bond dissociation energy of the first insulating film and a bond dissociation energy of the third insulating film.