Light Emitting Apparatus Using Planar Metal Lines
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Solution Overview
Problem
The challenge is to reduce the thickness of light emitting apparatuses while maintaining high yield and transfer-time efficiency, as thicker devices lead to lower light output and reduced integration density, making it difficult to embed bonding wires and increasing the complexity of handling LED chips.
Innovation Solution
The solution involves creating a light emitting apparatus with a first metal line and a second metal line, both formed through film creation processes, which are embedded within an insulator, allowing for reduced thickness without compromising yield or transfer-time efficiency, and enabling stable electrical and mechanical structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the light emitting apparatus is made thicker to increase light output, then the amount of light that can be fetched increases, but the scale of integration decreases and the thickness increases
Solution Approach 1:
The patent transitions from using bonding wires (1D linear structure) to metal lines formed through film creation processes (2D planar structure). This dimensional change allows the electrical connections to be made within the plane of the substrate rather than requiring vertical wire bonds, thereby reducing the thickness requirement while maintaining electrical connectivity and light output efficiency.
Solution Approach 2:
The patent replaces the mechanical bonding wire system with a film-based metal line system. Instead of using physical wires that require space and manual or automated wire bonding processes, the invention uses thin film deposition techniques to create conductive paths directly on the substrate, eliminating the need for thick bonding wires and reducing overall apparatus thickness.
2Quantity of substance
If the light emitting apparatus is made thicker to increase integration density, then more devices can be integrated, but the scale of integration per unit area decreases
Solution Approach 1:
By changing from vertical wire bonding to planar film-based metal lines, the patent enables higher integration density on the substrate surface. The film creation process allows multiple metal lines to be patterned in two dimensions, maximizing the use of substrate area and enabling more light emitting devices to be integrated per unit area without increasing thickness.
3Reliability
If bonding wires are used for electrical connection, then electrical connectivity is achieved, but the thickness increases and embedding becomes difficult
Solution Approach 1:
The patent substitutes the mechanical bonding wire system with a film-based metal line system created through deposition processes. This replacement maintains reliable electrical connectivity between the light emitting devices and the substrate while eliminating the thickness burden of bonding wires and enabling easy embedding within the substrate structure.
Solution Approach 2:
The patent merges the electrical connection function with the substrate structure itself. Instead of using separate bonding wires that need to be attached to the substrate, the metal lines are formed as an integral part of the substrate through film creation processes, combining the substrate and interconnect functions into a single integrated structure that reduces thickness and simplifies embedding.
Data Source
AI summary
A light emitting apparatus including: one or a plurality of light emitting devices each having a plurality of electrodes and each emitting light from the upper surface of the light emitting device; a plurality of terminal electrodes provided on the lower side of the light emitting devices in a positional relation with the light emitting devices and electrically connected to the electrodes of the light emitting devices; a first metal line brought into contact with the upper surfaces of the light emitting devices and one of the terminal electrodes, provided at a location separated away from side surfaces of the light emitting devices and created in a film creation process; and an insulator in which the light emitting devices and the first metal line are embedded.