Light-Emitting Device With Ion Implantation Scattering Cavities

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Solution Overview

Problem

Conventional light-emitting diodes (LEDs) face challenges in enhancing light extraction efficiency due to their inherent structural limitations, which restrict their performance and application potential.

Innovation Solution

The introduction of ion implantation regions on the substrate surface to create scattering cavities between the semiconductor layers, facilitating epitaxial growth and enhancing light extraction through the formation of amorphous or crystallized patterns that scatter light emitted from the active layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a conventional smooth substrate surface is used, then the manufacturing process is simple, but the light extraction efficiency is low

Engineering Contradiction:
Improvesubstrate surface preparationVSAvoidlight extraction efficiency
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

Ion implantation is performed on the substrate surface before epitaxial growth to pre-create a structured surface with scattering cavities. This preliminary action modifies the substrate surface to enhance light extraction efficiency while maintaining a relatively simple overall manufacturing process, as the scattering structure is formed in advance rather than requiring complex post-processing

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The physical and chemical parameters of the substrate surface are changed through ion implantation, creating regions with different crystalline structures (amorphous or crystallized patterns). These parameter changes in the substrate surface enable enhanced light scattering without fundamentally altering the manufacturing workflow

Inventive Principle:
Principle #35Parameter changes

2Loss of energy

If scattering cavities are formed through conventional methods, then light extraction is enhanced, but the manufacturing complexity increases

Engineering Contradiction:
Improvelight extraction efficiencyVSAvoidmanufacturing process complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The ion implantation process is combined with the existing epitaxial growth process to form scattering cavities. By integrating the scattering structure formation into the substrate preparation stage and utilizing the subsequent epitaxial growth to define cavity patterns, the manufacturing process achieves enhanced light extraction without significantly increasing overall process complexity

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

Ion implantation serves as an intermediary process that creates a modified substrate surface, which then guides the epitaxial growth to form scattering cavities. This intermediary approach enables the formation of complex scattering structures through a controlled, two-step process rather than requiring direct complex machining or patterning

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly improves light extraction efficiency by creating a structured surface that enhances the scattering of light, leading to improved performance and efficiency in light-emitting devices, particularly in LEDs.

Implementation Method 1

a substrate including an upper surface, wherein the upper surface includes an ion implantation region

Methodology Applied
Scientific EffectIon implantation: Ion Implantation

Implementation Method 2

a plurality of scattering cavities formed between the semiconductor layer and the upper surface in accordance with the ion implantation region

Methodology Applied
Scientific EffectLight scattering: Scattering

Data Source

PatentUS9362452B2Light-emitting device and the manufacturing method thereof
Publication Date: 2016.06.07 ENNOSTAR CORP
  • US9362452B2 patent drawing
  • US9362452B2 patent drawing
  • US9362452B2 patent drawing

AI summary

A light-emitting device includes: a substrate including an upper surface, wherein the upper surface includes an ion implantation region; a semiconductor layer formed on the upper surface; a light-emitting stack formed on the semiconductor layer; and a plurality of scattering cavities formed between the semiconductor layer and the upper surface in accordance with the ion implantation region.