Light-emitting device with segmented circuit layer for miniaturization
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Solution Overview
Problem
Traditional printed circuit boards for light-emitting diode devices are inadequate for the increasing demand for miniaturization and sophistication in modern products, requiring improved conductive and mechanical properties for semiconductor light-emitting sources.
Innovation Solution
A light-emitting device design featuring a substrate with a circuit layer, conductive connection portions, and semiconductor light-emitting sources, where the conductive connection portions are strategically placed on bonding pads and contact adjacent conductive structures, with an optional reflective layer and seed layer process for forming stable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional printed circuit boards are used for light-emitting diode devices, then the device structure is simple and easy to manufacture, but the printed circuit boards cannot meet the requirements of miniaturization and sophisticated techniques
Solution Approach 1:
The circuit board is segmented into multiple functional layers including substrate layer, first circuit layer, second circuit layer, and reflective layer. Each layer performs specific functions and is connected through conductive vias, allowing independent optimization of each layer while achieving overall miniaturization and sophisticated functionality
Solution Approach 2:
The patent transitions from traditional planar single-layer circuit board design to a multi-layer three-dimensional structure. Conductive vias connect different layers vertically, enabling sophisticated routing and miniaturization by utilizing the vertical dimension for signal transmission and power distribution
2Volume of moving object
If conductive structures are closely spaced to achieve miniaturization, then the device size is reduced, but the electrical connection stability between semiconductor light-emitting sources and circuit board deteriorates
Solution Approach 1:
The electrical connection path is segmented into multiple sections distributed across different layers. Semiconductor light-emitting sources are connected to conductive structures through conductive vias that traverse multiple layers, providing redundant connection paths and distributing mechanical stress, thereby maintaining connection reliability in miniaturized configurations
Solution Approach 2:
The patent employs composite material structures including copper conductive structures, reflective layers with high reflectivity, and multi-layer substrate combinations. These composite materials enhance electrical conductivity, thermal management, and mechanical stability, ensuring reliable electrical connections even when conductive structures are closely spaced
3Ease of manufacture
If conductive connection portions are formed directly on bonding pads without reflective layer, then the manufacturing process is simpler, but the conductive and mechanical properties are insufficient
Solution Approach 1:
The conductive connection system is segmented into multiple functional components: bonding pads on the first circuit layer, conductive vias for vertical connection, and conductive structures on the second circuit layer. This segmentation allows each component to be optimized independently while maintaining overall connection strength and ease of manufacture
Solution Approach 2:
Conductive vias serve as intermediary elements connecting the bonding pads on the first circuit layer to the conductive structures on the second circuit layer. These vias provide mechanical support and electrical continuity, bridging the gap between different layers and ensuring robust electrical connections without complicating the manufacturing process
Data Source
AI summary
A light-emitting device includes a substrate, a circuit layer, a plurality of conductive connection portions, and a plurality of semiconductor light-emitting sources. The circuit layer on the substrate having a plurality of conductive structures, in which each conductive structure includes at least one bonding pad. An interval is between two adjacent ones of the conductive structures. Each conductive connection portion is correspondingly located on each bonding pad. Each semiconductor light-emitting source crosses each interval and contacts two adjacent ones of the conductive connection portions, such that the semiconductor light-emitting sources are respectively electrically connected to two adjacent ones of the conductive structures.