Light-emitting Device With Segmented Inspection Lands
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Solution Overview
Problem
In light-emitting devices with multiple semiconductor structures mounted on a common substrate, it is challenging to inspect individual structures for defects like leakage current after they are coupled together, as overall voltage measurements cannot distinguish between individual cells, and defects may be masked by other cells.
Innovation Solution
The design includes a light-emitting device with a substrate having an interconnection layer and reflective members that expose specific lands for each semiconductor light-emitting structure, allowing for individual voltage drop measurements between these lands to detect leakage currents in each structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor light-emitting structures are mounted on a common substrate with electrode patterns, then the luminous flux is increased, but it becomes difficult to inspect individual structures for leakage current
Solution Approach 1:
The substrate is divided into multiple independent inspection regions, each corresponding to a specific semiconductor light-emitting structure. Each region has its own electrode pattern that is electrically isolated from other regions, allowing individual inspection of each light-emitting structure without interference from adjacent structures.
Solution Approach 2:
An insulating film is introduced as an intermediary layer between adjacent electrode patterns and semiconductor structures. This insulating film prevents electrical interference and leakage current paths between adjacent inspection regions, enabling clear individual measurement of each light-emitting structure.
2Ease of operation
If overall voltage measurement is performed on multiple coupled semiconductor structures, then the inspection process is simplified, but defects in individual cells cannot be distinguished
Solution Approach 1:
The electrode pattern is segmented into multiple independent sets, with each set dedicated to a specific semiconductor light-emitting structure. This segmentation allows voltage measurements to be performed on individual structures rather than the entire array, enabling precise defect detection while maintaining a systematic inspection process.
Solution Approach 2:
The substrate is pre-configured with distinct electrode patterns and insulating structures before the inspection process. This preliminary arrangement of electrical isolation structures enables individual measurements to be performed directly without requiring additional setup or disassembly, simplifying the inspection process while ensuring measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables easy inspection and detection of defects such as leakage current in each semiconductor light-emitting structure, improving the yield and reliability of the light-emitting device by allowing for individual electrical characteristic measurements.
Implementation Method 1
a first reflective member covering a portion of the interconnection layer and having an opening
Data Source
AI summary
A light-emitting device includes: a light-emitting element having an upper surface, and including a plurality of semiconductor light-emitting structures; and a substrate supporting the light-emitting element. The semiconductor light-emitting structures include a first semiconductor light-emitting structure and a second semiconductor light-emitting structure. The substrate includes: an interconnection layer including: a first interconnection portion comprising a first land, a second interconnection portion comprising a second land and a third land, and a third interconnection portion comprising a fourth land, and a first reflective member covering a portion of the interconnection layer and having an opening. The light-emitting element is located inside the opening of the first reflective member as viewed from above. A portion of the first land, a portion of the second land, a portion of the third land, and a portion of the fourth land are exposed in the opening of the first reflective member.