Light-Emitting Device Manufacturing With Segmented Silicon Substrate

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Solution Overview

Problem

Existing methods for manufacturing light-emitting devices face challenges in densely arranging light-emitting elements with consistent spacing, leading to variations in the distance between them.

Innovation Solution

A method involving a silicon substrate with grooves and semiconductor layered bodies, where a resin layer is applied and substrate regions are separated to mount the semiconductor layered bodies on a wiring substrate, allowing for precise positioning and dense arrangement of light-emitting elements with reduced spacing variations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a plurality of singulated light-emitting elements are placed on a substrate, then the light-emitting device can be manufactured, but variation in the spacing between the light-emitting elements increases

Engineering Contradiction:

Improvespacing between light-emitting elementsVSAvoidmanufacturing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The substrate is divided into multiple regions with different thicknesses, creating thick substrate regions supporting light-emitting elements and thin substrate regions between them. This segmentation allows precise positioning of elements while maintaining manufacturing efficiency through batch processing.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention introduces thickness variation as an additional dimensional parameter to control element spacing. By creating thickness differences in the substrate (vertical dimension), the patent achieves precise horizontal spacing control without requiring complex lateral positioning mechanisms.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If light-emitting elements are densely arranged, then the device compactness improves, but variation in spacing between elements increases

Engineering Contradiction:

Improvedevice areaVSAvoidspacing consistency

Core Design Contradiction:

Area of stationary objectVSManufacturing precision

Solution Approach 1:

Different regions of the substrate are given different thicknesses tailored to their specific functions. Thick regions provide stable support for elements requiring precise spacing, while thin regions allow for compact arrangement, creating local quality variations that optimize both density and precision.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The substrate thickness pattern is predetermined and prepared in advance before element placement. This preliminary structuring of the substrate with varying thickness regions guides the positioning of light-emitting elements, ensuring consistent spacing even in dense arrangements.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS11508705B2Method of manufacturing light-emitting device

Publication Date: 2022.11.22 NICHIA CORP

AI summary

A method of manufacturing the light-emitting device includes providing a structure body, mounting the structure body, removing a third substrate region of a silicon substrate of the structure body, disposing a resin layer, disposing a first mask member, removing a first substrate region of the silicon substrate, disposing a first wavelength conversion layer, removing the first mask member, and removing a second substrate region of the silicon substrate.