Semiconductor Light-Emitting Element Self-Assembly With Defect Repair
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Solution Overview
Problem
Existing methods for manufacturing large-screen displays using micro-sized semiconductor light-emitting elements face challenges in achieving high reliability, improving transfer accuracy, and resolving assembly defects during self-assembly processes.
Innovation Solution
A self-assembly apparatus and method that utilize a fluid chamber, magnetic forces, and electric fields to accurately position and assemble semiconductor light-emitting elements on an assembly substrate, while also incorporating a repair substrate to address assembly defects through selective electric field application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to assemble semiconductor light-emitting elements, then productivity is improved, but manufacturing precision deteriorates due to assembly defects
Solution Approach 1:
The patent replaces traditional mechanical pick-and-place methods with a self-assembly approach using fluid dynamics and magnetic fields. Semiconductor light-emitting elements are suspended in a fluid and guided to preset positions on the assembly substrate through controlled magnetic forces, eliminating mechanical contact and improving both productivity and precision simultaneously
Solution Approach 2:
The patent introduces a fluid medium as an intermediary between the semiconductor elements and the assembly substrate. The fluid allows elements to move freely and self-assemble at preset positions, while a magnet array spaced apart from the fluid chamber applies magnetic forces through the fluid to control element positioning without direct mechanical contact
2Manufacturing precision
If traditional assembly methods are used, then manufacturing precision is maintained, but productivity deteriorates due to low transfer efficiency
Solution Approach 1:
The patent enables semiconductor light-emitting elements to self-assemble at preset positions on the assembly substrate through magnetic guidance in a fluid medium. The elements find their own positions automatically without requiring precise mechanical placement, thereby maintaining high transfer accuracy while dramatically improving assembly throughput
3Reliability
If assembly defects occur during self-assembly, then reliability deteriorates, but resolving defects requires additional time and cost
Solution Approach 1:
The patent incorporates a repair substrate positioned to face the assembly substrate, equipped with pair electrodes that can generate electric fields to selectively move and correct misassembled semiconductor elements before final product completion. This preliminary defect correction capability prevents reliability issues from propagating and reduces subsequent rework time
Solution Approach 2:
The patent implements a feedback mechanism where assembly defects are detected and corrected in real-time during the self-assembly process. The repair substrate with controllable electric fields responds to misassembled elements by generating corrective forces, creating a closed-loop system that maintains high reliability while minimizing defect resolution time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed method enables high-yield, cost-effective assembly of semiconductor light-emitting elements, improving transfer accuracy and resolving assembly defects without physical contact, thus reducing costs and time associated with defect resolution.
Implementation Method 1
a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements
Implementation Method 2
a power supply unit configured to apply power to the assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate
Implementation Method 3
a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied
Data Source
AI summary
A self-assembly apparatus can include a fluid chamber for accommodating a fluid and semiconductor light-emitting elements, a conveyor to convey an assembly substrate so one surface of the assembly substrate is immersed in the fluid, the assembly substrate having a plurality of assembly electrodes, a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements, a power supply to apply power to the plurality of assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate, and a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied. The plurality of pair electrodes can be disposed at the same interval as the plurality of assembly electrodes.