Light-Emitting Element Electrode Structure for Short-Circuit Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light emitting elements are prone to short-circuit defects, which affect their electrical stability and performance.
Innovation Solution
A light emitting element design that includes a first semiconductor layer, a light emitting layer, a second semiconductor layer, and an electrode layer, with an insulative film surrounding the side surfaces of these layers and a portion of the electrode layer, ensuring adequate thickness and preventing short-circuit defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulative film thickness is increased to prevent short-circuit defects, then the reliability improves, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The insulative film is formed in advance before the electrode layer is deposited, ensuring that the insulation structure is already in place to prevent short-circuit defects between the electrode and semiconductor layers. This preliminary formation of the insulative film allows for better control of thickness and prevents manufacturing defects.
Solution Approach 2:
The insulative film is selectively applied to specific regions where short-circuit risks exist, such as around the electrode layer and semiconductor layers, rather than uniformly throughout the entire device. This localized approach maintains reliability while reducing unnecessary material usage and manufacturing complexity.
2Reliability
If the insulative film thickness is increased to prevent short-circuit defects, then the reliability improves, but the manufacturing precision requirements increase
Solution Approach 1:
The insulative film is formed as a preliminary layer before electrode deposition, allowing for controlled thickness accumulation. By forming the film in advance through sequential deposition processes, the thickness can be precisely controlled without requiring post-formation adjustments, thereby maintaining both reliability and manufacturing precision.
3Reliability
If the insulative film surrounds more areas including the electrode layer, then the short-circuit prevention improves, but the device complexity increases
Solution Approach 1:
The insulative film is selectively positioned to surround only the critical areas where short-circuit risks exist, such as the electrode layer and semiconductor layers interfaces. This localized insulation approach provides effective short-circuit prevention while avoiding unnecessary structural complexity in regions where insulation is not required.
Solution Approach 2:
The insulative film acts as an intermediary layer between conductive elements (electrode and semiconductor layers), providing electrical isolation without requiring complex structural modifications. This simple intermediary approach effectively prevents short-circuits while maintaining device structural simplicity.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
This light-emitting device comprises: a first semiconductor layer; a light-emitting layer arranged on the first semiconductor layer; a second semiconductor layer arranged on the light-emitting layer; an electrode layer arranged on the second semiconductor layer; and an insulating coat film. The insulating coat film surrounds side surfaces of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer, and surrounds a portion of the electrode layer at a first end portion on which the electrode layer is arranged. The electrode layer includes a first surface adjacent to the second semiconductor layer, and a second surface facing the first surface and having a width greater than that of the first surface.