Light-Emitting Structure With Integrated Heat Sink
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Solution Overview
Problem
In display devices, heat accumulation at light-emitting elements can reduce light-emission efficiency, and existing structures often fail to effectively dissipate heat without compromising light emission.
Innovation Solution
A light-emitting structure comprising a circuit substrate with a heat sink on one surface to dissipate heat generated by light-emitting elements, ensuring efficient heat management without obstructing light emission, combined with optical film layers and reflective layers to enhance light output and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is added to dissipate heat from light-emitting elements, then heat dissipation efficiency is improved, but device structure becomes more complex
Solution Approach 1:
The patent combines the heat sink with the circuit substrate into an integrated structure. The heat sink is formed as part of the circuit substrate itself, merging the electrical connection function and heat dissipation function into a single component, thereby improving heat dissipation without significantly increasing structural complexity
Solution Approach 2:
The circuit substrate is designed to serve multiple functions: electrical connection for the light-emitting elements and heat dissipation through its thermally conductive structure. This multi-functional design allows the same component to address both electrical and thermal management needs
2Illumination intensity
If optical film layers are added to enhance light output, then light-emission efficiency is improved, but device structure becomes more complex
Solution Approach 1:
The optical film layer is divided into multiple functional segments: a first optical film layer for light extraction and a second optical film layer for light uniformity. This segmentation allows each layer to perform its specific function efficiently while maintaining overall system performance
Solution Approach 2:
Different optical film layers are applied at different locations with different properties. The first optical film layer is positioned near the light-emitting elements for optimal light extraction, while the second optical film layer is positioned to achieve uniform light distribution across the display area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light-emission efficiency and uniformity by effectively dissipating heat from light-emitting elements, preventing accumulation and enhancing brightness and optical density, while maintaining the structural integrity and light transmission of the display device.
Implementation Method 1
a heat sink, located on a side of the first surface of the circuit substrate. The heat sink is configured for dissipating heat generated by the plurality of the light-emitting elements
Implementation Method 2
a plurality of light-emitting elements, arranged in an array on one of the first surface or the second surface of the circuit substrate. The plurality of the light-emitting elements is electrically connected to the wiring structure
Data Source
AI summary
A light-emitting structure, a backlight module, a display module, and a display device are provided. The light-emitting structure includes a circuit substrate, including a first surface and a second surface sequentially arranged along a light-exiting direction of the light-emitting structure. The circuit substrate also includes a light-transparent substrate and a wiring structure located on a side of the light-transparent substrate in a thickness direction. The light-emitting structure also includes a plurality of light-emitting elements, arranged in an array on one of the first surface or the second surface of the circuit substrate. The plurality of the light-emitting elements is electrically connected to the wiring structure. The light-emitting structure also includes a heat sink, located on a side of the first surface of the circuit substrate. The heat sink is configured for dissipating heat generated by the plurality of the light-emitting elements.