Light-Emitting Substrate With Laminated Reflective and Support Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light-emitting substrates face issues with warping and breaking due to high tensile forces applied to the substrate, particularly when a reflective layer is formed using screen printing, which compromises the structural integrity and manufacturing efficiency.
Innovation Solution
A light-emitting substrate design featuring a reflective layer and a support layer on opposite sides of the circuit board, with synchronized fabrication using a lamination process to balance tensile forces, and a barrier wall and encapsulation layer to disperse stress, ensuring uniform thickness and material consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a reflective layer is formed using screen printing on the circuit board, then light exit efficiency is improved, but the substrate experiences high tensile forces causing warping and breaking
Solution Approach 1:
The reflective layer is segmented into multiple reflective units arranged in an array pattern, where each unit corresponds to a light-emitting device. This segmentation distributes the tensile forces across multiple discrete units rather than applying a continuous layer, reducing the overall stress concentration and preventing substrate warping and breaking while maintaining light reflection efficiency
Solution Approach 2:
A support layer is added to the circuit board structure that provides counterbalancing tensile forces to offset the high tensile stresses generated by the reflective layer. This support layer acts as a counterweight, compensating for the mechanical stress and preventing substrate deformation and failure
2Illumination intensity
If a reflective layer is formed using screen printing, then light reflection is enhanced, but manufacturing complexity and time increase
Solution Approach 1:
The reflective units are integrated directly into the circuit board structure during the manufacturing process, merging the reflective layer formation with the substrate fabrication steps. This integration eliminates separate manufacturing steps and reduces production time while maintaining the light reflection enhancement
3Weight of moving object
If the circuit board is made thinner to reduce weight, then portability is improved, but the substrate becomes more susceptible to warping and breaking under tensile stress
Solution Approach 1:
The support layer provides counterbalancing tensile forces that compensate for the reduced thickness of the circuit board. This support structure enables the use of thinner substrates by offsetting the increased susceptibility to warping and breaking, thus achieving both weight reduction and structural integrity
Solution Approach 2:
The circuit board is constructed as a composite structure combining the circuit board substrate with the support layer and reflective units. This composite design allows the use of thinner materials while maintaining overall structural strength through the synergistic combination of components with different mechanical properties
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces warpage and breaking risks, enhances light exit efficiency, and improves luminance and chroma uniformity, resulting in improved display performance.
Implementation Method 1
The reflective layer is disposed on the circuit board; the reflective layer is provided with a plurality of openings therein
Implementation Method 2
synchronized fabrication using a lamination process to balance tensile forces
Data Source
AI summary
A light-emitting substrate includes a circuit board, a plurality of light-emitting devices, a reflective layer and a support layer. The plurality of light-emitting devices are disposed on the circuit board. The reflective layer is disposed on the circuit board; the reflective layer is provided with a plurality of openings therein, and a light-emitting device is located in an opening. The support layer is disposed on a side of the circuit board away from the reflective layer.