Light-Emitting Element Mounting Substrate with Penetrating Metal Blocks
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Solution Overview
Problem
Existing light-emitting element mounting substrates face challenges in achieving effective heat dissipation and reliable electrical connectivity between the front and back sides, with insufficient heat dissipation performance and potential for substrate cracking due to bending.
Innovation Solution
A light-emitting element mounting substrate with a substrate made of insulating resin, featuring metal blocks that penetrate through conductor layers and through-hole conductors, where the metal blocks have a larger diameter than the through-hole conductors, ensuring efficient heat dissipation and electrical connection, and a manufacturing method involving positioning holes, metal block insertion, and metal plating to form through-hole conductors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal blocks are used to penetrate through conductor layers for heat dissipation, then heat dissipation performance is improved, but substrate cracking may occur due to bending stress
Solution Approach 1:
The patent uses a composite structure combining metal blocks (high thermal conductivity) with insulating resin substrate. The metal blocks provide excellent heat dissipation while the insulating resin matrix provides mechanical strength and flexibility, preventing substrate cracking during bending. This composite approach allows the system to simultaneously achieve superior thermal performance and mechanical integrity.
2Reliability
If through-hole conductors are formed adjacent to metal blocks, then electrical connectivity is improved, but manufacturing complexity increases
Solution Approach 1:
The patent forms positioning holes through the substrate before inserting metal blocks, and then forms through-hole conductors adjacent to the metal blocks in subsequent steps. This preliminary positioning hole formation simplifies the overall manufacturing process by establishing precise locations for both metal blocks and through-hole conductors, reducing alignment complexity and improving electrical connectivity reliability.
3Temperature
If metal blocks with larger diameter than through-hole conductors are used, then heat dissipation efficiency is improved, but positioning precision requirements increase
Solution Approach 1:
The patent segments the functional elements into distinct components: metal blocks for heat dissipation and through-hole conductors for electrical connectivity. The positioning holes are formed as separate preliminary features that guide metal block insertion. This segmentation allows the metal blocks to have larger diameters for superior heat dissipation while the positioning holes ensure precise placement, reducing positioning precision requirements during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation performance and reliable electrical connectivity, improving the substrate's reliability and mounting accuracy while preventing substrate cracking during bending.
Implementation Method 1
metal blocks that are penetrating through the first conductor layer, the substrate and the second conductor layer... enhanced heat dissipation performance
Implementation Method 2
through-hole conductors that electrically connect the first conductor layer and the second conductor layer
Implementation Method 3
applying metal plating to the positioning holes such that through-hole conductors are formed in the positioning holes respectively
Data Source
AI summary
A light-emitting element mounting substrate includes a substrate including insulating resin, a first conductor layer formed on a first surface of the substrate and having an element mounting portion, a second conductor layer formed on a second surface of the substrate on the opposite side of the first surface, metal blocks formed such that the metal blocks are penetrating through the first conductor layer, the substrate and the second conductor layer and positioned in the element mounting portion of the first conductor layer, and through-hole conductors formed adjacent to the metal blocks respectively such that the through-hole conductors electrically connect the first conductor layer and the second conductor layer and that a diameter of each metal block is larger than a diameter of each through-hole conductor.