Light-Emitting Device Repair via Test Trace Segmentation
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Solution Overview
Problem
Current manufacturing processes for light-emitting devices face challenges in repairing defective light-emitting elements, leading to low yield production due to the risk of damaging the circuit board during the repair process.
Innovation Solution
A manufacturing method that involves forming test traces and signal traces on a substrate, connecting light-emitting elements to these traces, performing a test procedure, encapsulating the element, and then removing the test traces to form a driving unit, allowing for the repair of abnormal elements without damaging the driving unit during the repair process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a mass transfer technique is used to transfer a large number of light-emitting elements onto a circuit substrate, then the productivity is improved, but the reliability deteriorates because the circuit board may be damaged during repair procedures
Solution Approach 1:
The patent divides the substrate into two distinct parts: a first substrate that carries the light-emitting elements and test traces, and a second substrate (circuit substrate) that contains the pixel circuits and driving units. This segmentation allows the light-emitting elements to be tested and repaired on the first substrate without risking damage to the circuit board, thereby maintaining both high productivity through mass transfer and reliability by protecting the circuit board during repair procedures
Solution Approach 2:
The patent introduces a first substrate as an intermediary carrier that temporarily holds the light-emitting elements and provides test traces for evaluation. This intermediary layer acts as a buffer between the light-emitting elements and the final circuit substrate, enabling testing and repair operations to be performed on the intermediary first substrate before final assembly, thus preventing potential damage to the circuit board while maintaining production efficiency
2Measurement precision
If test traces are present during driving unit formation, then the measurement precision is improved for testing light-emitting elements, but the device complexity increases due to additional traces and repair procedures
Solution Approach 1:
The patent implements preliminary testing by forming test traces on the first substrate before the light-emitting elements are permanently mounted and before the driving units are formed on the second substrate. This preliminary action allows all testing and repair operations to be completed in advance, simplifying the final device structure by eliminating the need for test traces in the finished product while maintaining high measurement precision during the manufacturing process
Data Source
AI summary
A manufacturing method of a light-emitting device including the following steps is provided. A test trace and a first signal trace are formed on a first substrate. A light-emitting element electrically connected to the test trace and the first signal trace is formed. A test procedure is performed on the light-emitting element via the test trace and the first signal trace. An encapsulation layer is formed on the first substrate to cover the light-emitting element. The test trace is removed, and then a driving unit electrically connected to light-emitting element is formed.