Light-Emitting Element Transfer for Reliable Support Substrate Separation
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Solution Overview
Problem
Existing methods for manufacturing light-emitting devices face challenges in reliably separating the support substrate from the light-emitting elements.
Innovation Solution
A method involving a first structure with a support substrate, a first bonding member, and light-emitting elements, and a second structure with a base member, terminal portions, and a second bonding member, where the structures are aligned and connected, and then the bonding members are exposed to a solution to remove them, thereby separating the support substrate from the light-emitting elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a bonding member is used to mount light-emitting elements on a base member, then the light-emitting elements can be securely fixed, but the support substrate cannot be reliably separated from the light-emitting elements
Solution Approach 1:
The bonding member is divided into two distinct parts: a first bonding member that bonds the light-emitting element to the support substrate, and a second bonding member that bonds the light-emitting element to the base member. This segmentation allows the support substrate to be separated by removing only the first bonding member, while the light-emitting element remains secured to the base member via the second bonding member.
Solution Approach 2:
The first bonding member is designed to be removable or degradable, allowing it to be extracted from the system after the light-emitting element has been transferred to the base member. This extraction enables the support substrate to be separated cleanly without damaging the light-emitting element or the base member assembly.
2Strength
If the bonding member is made strong to ensure secure mounting, then the light-emitting elements are firmly fixed, but the separation process becomes more difficult and risky
Solution Approach 1:
The bonding function is segmented into two independent bonding members with different strength characteristics. The first bonding member provides sufficient strength for mounting and handling on the support substrate, while the second bonding member provides the primary secure attachment to the base member. This segmentation allows the first bonding member to be designed for easy removal without compromising the overall bonding strength needed during assembly.
Solution Approach 2:
Different bonding members are designed with different local qualities: the first bonding member has properties optimized for temporary attachment and easy removal (e.g., lower bond strength, susceptibility to specific removal conditions), while the second bonding member has properties optimized for permanent, strong attachment. This local differentiation of bonding properties allows strong fixation during assembly while enabling safe separation afterward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for a more reliable separation of the support substrate from the light-emitting elements, reducing the risk of damage and simplifying the manufacturing process.
Implementation Method 1
exposing the first bonding member and the second bonding member to a solution to remove the first bonding member and the second bonding member
Data Source
AI summary
A method for manufacturing a light-emitting device including providing a first structure having a support substrate, a first bonding member on a surface thereof, and light-emitting elements having a first surface in contact with the first bonding member, an opposite second surface, and electrodes on a second surface side. The method includes providing a second structure having a substrate including a base member and terminal portions on a surface thereof, and a second bonding member between the terminal portions and thicker than the terminal portions. The method includes disposing the first structure on the second bonding member such that respective electrodes and respective terminal portions are spaced apart from and facing each other, connecting the respective electrodes and the respective terminal portions, and after the connecting, exposing the first and second bonding members to a solution to remove them to separate off the support substrate from the light-emitting elements.