Light Emitting Wiring Layout Without Custom Circuit Boards
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Solution Overview
Problem
Existing methods for manufacturing light emitting devices require a wiring board with a specific wiring pattern to interconnect light emitting elements, which limits design flexibility and increases manufacturing costs.
Innovation Solution
A method of manufacturing a light emitting device where the wiring for interconnecting light emitting elements is formed directly on the device, eliminating the need for a custom-designed wiring board, and using a jumper element to connect wires of different polarities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a wiring board with custom wiring pattern is provided to interconnect light emitting elements, then the light emitting elements can be electrically connected, but the design flexibility is limited and manufacturing costs increase
Solution Approach 1:
The patent introduces a jumper element as an intermediary component to connect light emitting elements. Instead of requiring custom wiring boards, the jumper element serves as a universal intermediary that can adapt to different arrangements of light emitting elements, thereby maintaining electrical connection reliability while improving design flexibility and reducing manufacturing costs.
2Reliability
If a wiring board with custom wiring pattern is provided to interconnect light emitting elements, then the light emitting elements can be electrically connected, but the manufacturing costs increase
Solution Approach 1:
The jumper element acts as a standardized intermediary component that simplifies the manufacturing process. Rather than requiring custom-designed wiring boards for each application, the universal jumper element can be used across different configurations, significantly reducing design and manufacturing costs while ensuring reliable electrical connections.
Solution Approach 2:
The jumper element is designed as a universal component that can serve multiple functions and adapt to different arrangements of light emitting elements. This multi-functionality eliminates the need for application-specific wiring boards, thereby reducing manufacturing costs and improving ease of manufacture across various applications.
Data Source
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AI summary
A method of manufacturing a light emitting device including: forming grooves by removing a portion of a first resin of a first light emitting structure 100A including a first light emitting element 110A and the first resin, a portion of a second resin of a second light emitting structure 100B including a second light emitting element 110B and the second resin, and a portion of a third resin of a circuit element 250 including a conducting part covered by the third resin, thereby forming a first groove straddling the first resin and the third resin, a second groove straddling the second resin and the third resin, and a third groove extending between the first groove and the second groove; supplying a first conducting material in the first grove and the second groove thereby forming first wiring 210, including a plurality of independent parts; and supplying a second conducting material in the third groove thereby forming second wiring 220 electrically separated from the first wiring.