Light Field Camera Structure for Thin Display Devices
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Solution Overview
Problem
The existing light field cameras integrated into display devices occupy a large volume and protrude from the surface due to the large distance between the main lens and the microlens array, making it difficult to achieve thinness in display devices.
Innovation Solution
A structure for collecting light field information that includes a base substrate with sensor chips and micro-imaging structures, where the micro-imaging structures directly capture ambient light without a main lens, reducing the thickness and enabling surface planarity when integrated into display devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a main lens and microlens array are used to capture light field information, then light field information can be acquired, but the device occupies large volume and protrudes from the surface
Solution Approach 1:
The patent extracts and removes the main lens from the light field camera structure, retaining only the microlens array and sensor chip. This extraction eliminates the large distance requirement between main lens and microlens array, significantly reducing the overall device volume while preserving light field information acquisition capability through the remaining microlens array-sensor chip combination.
Solution Approach 2:
The patent employs a thin film substrate to mount the microlens array and sensor chip in close proximity. This thin film structure enables the light field information collecting unit to achieve surface planarity when integrated into display devices, allowing the device to be thin and flexible without protruding from the surface while still capturing light field information.
2Measurement precision
If a main lens and microlens array are arranged with large distance, then proper light field processing can be achieved, but the display device thickness increases
Solution Approach 1:
The patent nests the microlens array and sensor chip in close proximity on a thin film substrate, eliminating the need for large separation distance. The microlens array is positioned directly over the sensor chip, allowing both components to be integrated within a thin profile that maintains display device thickness requirements while still enabling proper light field processing through the nested arrangement.
Solution Approach 2:
The thin film substrate serves as a flexible mounting platform that brings the microlens array and sensor chip into close proximity, reducing the optical path length required for light field processing. This thin film structure enables the entire light field information collecting unit to be integrated within a thin display device profile without compromising processing quality.
3Shape
If sensor chips are embedded into base substrate, then surface planarity can be achieved, but the micro-lens structures need support structures to maintain spacing
Solution Approach 1:
The patent applies local quality by providing support structures only at specific locations between adjacent sensor chips, rather than a comprehensive support system throughout the entire device. These localized support structures maintain the required spacing between microlens structures and sensor chips while minimizing overall device complexity and allowing surface planarity to be achieved in the embedded regions.
Solution Approach 2:
The patent segments the support function into discrete support structures positioned between pairs of adjacent sensor chips. This segmentation allows each support structure to independently maintain spacing for its corresponding microlens structures, simplifying the overall design compared to a continuous support system while still achieving the required surface planarity and spacing maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for a significant reduction in thickness, enabling the integration of light field information collection into display devices without increasing their thickness, enhancing the thinness and planarity of the display device.
Implementation Method 1
micro-imaging structures which are located above a side, facing away from the base substrate, of the sensor chips, where each of the plurality of micro-imaging structures corresponds to a respective one of the sensor chips
Implementation Method 2
the respective one sensor chip is configured to receive light field information passing through the each micro-imaging structure
Data Source
AI summary
The present disclosure discloses a structure for collecting light field information, a display device, and a control method of the display device. The structure for collecting light field information includes a base substrate, a plurality of sensor chips located on the base substrate, where each of the plurality of sensor chips includes a plurality of sensing units arranged in an array, and a plurality of micro-imaging structures located above a side, facing away from the base substrate, of the plurality of sensor chips. Each of the plurality of micro-imaging structures corresponds to a respective one of the sensor chips. An orthographic projection of the respective one sensor chip on the base substrate has an overlapping region with an orthographic projection of the each micro-imaging structure on the base substrate. The respective one sensor chip is configured to receive light field information passing through the each micro-imaging structure.