Wafer-Level Light-Field Camera Lens Cube Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional light-field cameras often have complex and costly designs with adjustable focus mechanisms, which can be cumbersome and inefficient in integrating multiple lens systems for high-resolution and light-field imaging.
Innovation Solution
The use of wafer-level image optical sensor fabrication techniques to simultaneously form light-field and high-resolution camera modules with multiple-lens arrays and microlens plates, where lens elements are bonded with spacer plates to create lens cubes, allowing for fixed optical paths but enabling adjustable focus through image processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional light-field cameras use adjustable focus mechanisms with multiple lens systems, then imaging flexibility is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple lens systems (high-resolution camera lens and light-field camera lens) into a single integrated lens assembly. The lens assembly includes lens elements with apertures that serve dual functions for both high-resolution and light-field imaging, eliminating the need for separate adjustable focus mechanisms and reducing overall device complexity while maintaining imaging flexibility through fixed optical paths
Solution Approach 2:
The lens elements in the integrated lens assembly are designed to perform multiple functions simultaneously. The same lens elements with apertures are used for both high-resolution imaging and light-field imaging, making the optical system universal and eliminating the need for separate dedicated lens systems for each imaging mode
2Manufacturing precision
If conventional light-field cameras use separate lens systems for high-resolution and light-field imaging, then imaging quality is improved, but manufacturing cost and integration difficulty increase
Solution Approach 1:
The patent merges the high-resolution camera lens and light-field camera lens into a single integrated lens assembly that is manufactured as one unit. This consolidation reduces the number of separate manufacturing processes, alignment steps, and assembly operations required, thereby reducing manufacturing cost and integration difficulty while maintaining the optical quality needed for both imaging modes
3Productivity
If wafer-level fabrication techniques are used to simultaneously form light-field and high-resolution camera modules, then manufacturing efficiency is improved, but device complexity in integration increases
Solution Approach 1:
The patent uses wafer-level fabrication techniques to simultaneously form multiple camera modules (both light-field and high-resolution) on a single wafer substrate. This batch processing approach manufactures all lens elements, apertures, and optical components in parallel, dramatically improving manufacturing efficiency and reducing integration complexity by eliminating the need for separate manufacturing and assembly processes for each camera module
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process and reduces costs while enabling high-resolution and light-field imaging with adjustable focus capabilities, enhancing image quality and flexibility in image processing.
Implementation Method 1
A focus lens 102 focuses light 112 from a scene 110 onto the microlens array 104 and thence to film 106
Implementation Method 2
A focus lens 102 focuses light 112 from a scene 110 onto the microlens array 104
Data Source
AI summary
A camera module has light-field camera(s) and high resolution camera(s), the light-field camera(s) have multiple-lens arrays above an image sensor. The light-field camera(s) have a lens element at a same level as a lens element of the high resolution camera, the lens elements bearing apertures. The multiple-lens array of the light-field camera is above the image sensor at a same level as a flat transparent plate of the high resolution camera. The cameras lens cubes are made simultaneously by bonding molded lens plates and spacer plates, the lens plates and spacer plates including an upper lens plate having upper light-field camera lens elements and upper high resolution camera lens elements with applied apertures, multiple spacer plates, a microlens plate bearing an array of microlenses in the light-field cameras, the microlens plate being flat and transparent in areas of the high resolution camera.