Light Field Imaging Device Air Gap Support Structures
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Solution Overview
Problem
Conventional light field imaging devices face challenges in integrating the microlens array and image sensor into a chip without incurring optical loss, leading to increased device volume, higher costs, and image quality deterioration due to mechanical mismatches and separate fabrication processes.
Innovation Solution
A light field imaging device is designed with a support structure between the image sensor and microlens array to create an air gap, using a pillar-shaped first support structure and a plate-shaped second support structure to integrate the components into a chip, while maintaining minimal optical loss by using a zigzag pattern for the support structures and alternating openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the microlens array and image sensor are integrated into a chip, then device volume is reduced and manufacturing cost is lowered, but optical loss increases and image quality deteriorates due to mechanical mismatches
Solution Approach 1:
The microlens array is divided into multiple microlenses, each corresponding to multiple pixels, with support structures positioned at vertices to segment the integration space and reduce mechanical stress
Solution Approach 2:
Support structures are introduced as intermediary elements between the microlens array and image sensor, providing mechanical support while maintaining optical path integrity and reducing direct contact-induced mismatches
2Ease of manufacture
If the microlens array and image sensor are integrated into a chip, then manufacturing cost is lowered, but manufacturing precision becomes more difficult due to mechanical mismatches
Solution Approach 1:
Support structures are formed beforehand on the image sensor before integrating the microlens array, establishing precise alignment references that guide subsequent fabrication steps and ensure accurate positioning
Solution Approach 2:
The support structures are strategically positioned at specific locations (vertices of microlenses) rather than uniformly distributed, providing localized support where needed most to maintain precision while minimizing overall interference
3Loss of energy
If support structures are added to provide an air gap between the image sensor and microlens array, then optical loss is reduced, but device complexity increases
Solution Approach 1:
The support structure system is segmented into multiple discrete elements distributed across the device, with each element performing a localized function, making the overall complex structure manageable and manufacturable
Solution Approach 2:
The support structures serve multiple functions simultaneously: providing mechanical support, maintaining air gap for optical performance, enabling heat dissipation, and serving as alignment references, thereby justifying the added complexity through functional consolidation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integration method reduces optical loss, simplifies the device structure, and lowers fabrication costs by minimizing mechanical mismatches and allowing for improved image acquisition with reduced device volume.
Implementation Method 1
a support structure formed between the image sensor and the microlens array for providing an air gap therebetween
Data Source
AI summary
A light field imaging device includes an image sensor having a plurality of pixels arranged two-dimensionally therein; a microlens array formed over the image sensor, the microlens array having a plurality of microlenses arranged two-dimensionally therein; and a plurality of support structures formed between the image sensor and the microlens array for providing an air gap therebetween.