Light Guide Plate Adhesive Layout for Stable Backlight Alignment
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Solution Overview
Problem
The existing backlight modules face challenges in reducing the risk of shifting between the light guide plate and the circuit board, which affects the stability and efficiency of light emission.
Innovation Solution
An electronic device design featuring a light guide plate with an adhesive structure having first and second openings, where the adhesive structure includes segmented elements with varying widths and configurations to enhance attachment to the circuit board, and a reflective layer is placed between the adhesive structure and the circuit board to optimize light emission and reduce interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a light guide plate is attached to the circuit board through an adhesive structure, then the light guide plate is secured to the circuit board, but the risk of shifting between the light guide plate and the circuit board increases
Solution Approach 1:
The adhesive structure is divided into multiple adhesive elements (first adhesive element, second adhesive element, third adhesive element) with different shapes and positions. This segmentation allows each element to perform specialized functions: the first adhesive element provides strong bonding, the second adhesive element prevents lateral shifting, and the third adhesive element fills gaps and enhances overall attachment stability.
Solution Approach 2:
Different regions of the adhesive structure have different properties tailored to local requirements. The first adhesive element has a first shape optimized for bonding strength, the second adhesive element has a second shape optimized for preventing shift, and the third adhesive element has a third shape optimized for gap filling. This local differentiation resolves the contradiction by addressing both attachment stability and position stability through specialized local configurations.
2Strength
If the adhesive structure covers the entire bonding area, then the attachment strength is maximized, but the light-emitting elements are interfered with
Solution Approach 1:
The adhesive structure is segmented into multiple discrete adhesive elements rather than a continuous layer. This segmentation creates gaps between the adhesive elements, allowing light from the light-emitting elements to pass through without being blocked. The segmentation maintains sufficient adhesion strength through the distributed adhesive elements while eliminating the harmful blocking effect of a continuous adhesive layer.
Solution Approach 2:
The adhesive structure is extracted from a continuous covering form and reconfigured as discrete elements with specific shapes and positions. This extraction removes the harmful blocking effect on light emission while retaining the necessary adhesive function. The adhesive elements are strategically placed to provide strength without interfering with the light path.
3Illumination intensity
If a reflective layer is added between the adhesive structure and the circuit board, then light emission efficiency is improved, but the device complexity increases
Solution Approach 1:
The reflective layer is merged with the adhesive structure to form an integrated component. The reflective layer is positioned at the bottom of the adhesive structure, combining the adhesive function with the light reflection function in a single integrated element. This merging improves light emission efficiency by reflecting light that would otherwise be lost, while minimizing the increase in device complexity through functional integration.
Solution Approach 2:
The adhesive structure is given multiple functions: it provides mechanical attachment, prevents shifting, and incorporates a reflective layer to enhance light emission. This multi-functionality resolves the contradiction by making the adhesive structure universally beneficial - it not only secures the light guide plate but also actively improves light emission efficiency, justifying the added complexity through multiple performance benefits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases the adhesion between the light guide plate and the circuit board, reduces the risk of shifting, and minimizes interference with light-emitting elements, thereby enhancing the stability and efficiency of light emission.
Implementation Method 1
an adhesive structure between the circuit board and the light guide plate
Implementation Method 2
a reflective layer disposed between the adhesive structure and the circuit board
Data Source
AI summary
An electronic device is provided. The electronic device includes a circuit board, a first light-emitting element and a second light-emitting element disposed on the circuit board along a first direction. The electronic device includes a light guide plate and an adhesive structure between the circuit board and the light guide plate and having a first opening and a second opening. The electronic device includes a reflective layer disposed between the adhesive structure and the circuit board. The first and second light-emitting elements are disposed in the first and second openings respectively. A portion of the adhesive structure disposed between the first and second openings includes a first part and a second part, the first part is disposed between the first and second light-emitting elements, and the second part is connected with the first part and extends toward the light guide plate.