Light Guide Heat Dissipation Module for Expansion Card Visibility
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Solution Overview
Problem
In electronic devices, expansion cards in dark environments are difficult to locate, making it challenging to insert them correctly due to the lack of visibility, which affects heat dissipation efficiency.
Innovation Solution
A light guide heat dissipation module that combines heat dissipation and light guidance functions, featuring a first and second heat dissipation member, a light guide member, and a light source assembly, where the light source is positioned beside the light incident surface of the light guide member and emits light rays through the opening of the first heat dissipation member, providing illumination and aiding in card insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation module is disposed on the expansion card, then heat dissipation function is improved, but visibility in dark environment deteriorates
Solution Approach 1:
The patent combines the heat dissipation module and light guide module into a single integrated structure. The light guide member is disposed within the heat dissipation module, allowing both heat dissipation and light guidance functions to be performed by one component rather than separate parts.
Solution Approach 2:
The heat dissipation module is designed to perform multiple functions: it dissipates heat from the expansion card while simultaneously guiding light to illuminate the card insertion area. This multi-functional design eliminates the need for separate components.
2Adaptability or versatility
If expansion cards are disposed on main boards for user expansion, then adaptability is improved, but ease of operation in dark environment deteriorates
Solution Approach 1:
The light guide module is pre-integrated into the heat dissipation module structure, so that illumination is automatically provided when the module is installed on the main board. The light guiding function is prepared in advance to assist users during card insertion operations.
3Illumination intensity
If a light guide module is added to provide illumination, then visibility is improved, but device complexity increases
Solution Approach 1:
By merging the light guide module with the heat dissipation module into a single integrated component, the patent avoids the complexity that would arise from adding a separate light guide module. The combined structure shares common components and mounting interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively dissipates heat while providing a light guidance function, enhancing the ease of expansion card insertion and operation in dark environments by emitting light rays through the light guide member, thus improving usability and visibility.
Implementation Method 1
The light guide member includes a light incident surface. The light source assembly includes a light source and a pad electrically connected to the light source. The light source is disposed beside the light incident surface of the light guide member.
Implementation Method 2
The second heat dissipation member is thermally coupled to the first heat dissipation member
Data Source
AI summary
A light guide heat dissipation module includes a first heat dissipation member, a second heat dissipation member, a light guide member, and a light source assembly. The first heat dissipation member includes an opening. The second heat dissipation member is thermally coupled to the first heat dissipation member. The light guide member is disposed between the first heat dissipation member and the second heat dissipation member. The opening of the first heat dissipation member exposes a portion of the light guide member. The light guide member includes a light incident surface. The light source assembly includes a light source and a pad electrically connected to the light source. The light source is disposed beside the light incident surface of the light guide member. The pad is disposed on a bottom surface of the second heat dissipation member away from the first heat dissipation member. An electronic device including the light guide heat dissipation module is further provided.


