Light Guide Structure Recesses for Display Panel Stress Relief
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Solution Overview
Problem
Display devices experience image sticking due to thermal expansion and contraction of paste materials between the circuit board and light guide structure, especially in high-temperature and high-humidity environments, leading to stress concentration and panel deformation.
Innovation Solution
The formation of first recesses on the peripheral surface of the light guide structure, corresponding to plating pads, allows the paste materials to function as a spring, reducing stress concentration by allowing the pads to move with thermal deformation, thereby preventing image sticking.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If paste materials are used to electrically connect the circuit board and light guide structure, then electrical connection is achieved, but thermal expansion and contraction cause stress concentration and image sticking
Solution Approach 1:
The patent introduces a cushioning cavity within the light guide structure at the location where paste materials are applied. This cavity acts as a buffer zone that absorbs thermal expansion and contraction stresses before they can concentrate in the paste materials. The cushioning cavity is designed with specific dimensions and positioning to ensure it effectively accommodates the dimensional changes of the paste materials during temperature variations, thereby preventing stress concentration and image sticking while maintaining reliable electrical connection.
2Stability of the object's composition
If paste materials are rigidly fixed between circuit board and light guide structure, then stable electrical connection is achieved, but thermal deformation causes image sticking
Solution Approach 1:
The patent transforms the rigid fixed connection into a dynamic adaptable connection by incorporating the cushioning cavity. This cavity allows the paste materials to dynamically adjust their position and shape in response to thermal expansion and contraction. The cavity provides movement space that enables the paste materials to deform elastically without breaking the electrical connection, thus maintaining connection stability while preventing the rigid stress transfer that causes image sticking.
3Strength
If light guide structure is made rigid for structural strength, then mechanical strength is improved, but thermal expansion stress cannot be relieved causing image sticking
Solution Approach 1:
The patent applies local quality modification by introducing the cushioning cavity only at specific locations where paste materials are applied, rather than making the entire light guide structure flexible. The light guide structure maintains its overall rigid structure for mechanical strength, but locally incorporates the cushioning cavity that provides thermal deformation accommodation. This localized approach allows the structure to be both strong and adaptable to thermal changes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recesses effectively mitigate stress concentration in the paste materials, preventing image sticking on the display panel by accommodating thermal expansion and contraction, ensuring reliable operation in varying environmental conditions.
Implementation Method 1
the paste materials may deform due to thermal expansion and contraction
Data Source
AI summary
A display device includes a display panel, a circuit board, a light guide structure and two paste materials. The circuit board is disposed on the display panel. The light guide structure is disposed on the display panel. The light guide structure has a bottom surface and a peripheral surface, wherein the bottom surface is oriented toward the display panel and the peripheral surface is adjacent to the bottom surface. Two plating pads are formed on the bottom surface. Two first recesses are formed on the peripheral surface and corresponding to the two plating pads. The two paste materials are formed between the two plating pads and the circuit board.


