Light Guide Device with Thermal Air Gap for Uniform Backlighting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing light guiding devices face challenges in achieving uniform light distribution, thermal management, and mechanical integrity, particularly in thin and efficient backlight designs for displays, which often result in non-uniform illumination, mechanical damage, and increased thickness.
Innovation Solution
A light guide device comprising a base substrate with mounted light sources and a guide layer, encapsulating the sources, along with thermal bonding material contacting a heat sink plate to form an air gap, and incorporating scattering and reflective structures to direct light parallel to the substrate plane, enhancing optical coupling and mechanical protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If light sources are distributed across the panel in direct-lit configuration, then backlight thickness is reduced and efficiency is improved, but light uniformity deteriorates with dark spots and intense areas appearing
Solution Approach 1:
The patent introduces a light guide layer as an intermediary component between the distributed LED light sources and the display panel. This light guide layer captures light from multiple LEDs and redistributes it uniformly across the backlight area, eliminating dark spots and intense areas while maintaining the thin direct-lit configuration.
Solution Approach 2:
The patent applies local quality by positioning scattering structures and reflective elements at specific locations within the light guide layer. These structures have different optical properties in different regions, allowing light to be redirected and distributed uniformly across the panel while maintaining overall thinness.
2Reliability
If light sources are edge-coupled to the light guide, then mechanical damage susceptibility increases and production complexity increases, but light coupling efficiency can be achieved
Solution Approach 1:
The patent merges the light source mounting function with the light guide structure by integrating LED mounting directly into the light guide layer. This eliminates separate coupling mechanisms, reduces production steps, and improves mechanical integrity by distributing stress across the integrated structure rather than at discrete coupling points.
3Temperature
If heat dissipation structures are added to manage thermal load, then weight and thickness increase, but thermal management performance improves
Solution Approach 1:
The patent makes the light guide layer multi-functional by designing it to simultaneously guide light uniformly across the panel and dissipate heat from LED sources. The same structural elements that distribute light also serve as thermal pathways, eliminating the need for separate heat dissipation structures and maintaining thin profile.
Solution Approach 2:
The patent employs composite materials in the light guide layer that combine optical transparency with high thermal conductivity. This allows the material to perform both light guiding and heat dissipation functions effectively without increasing thickness, as the composite structure inherently provides both optical and thermal management properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a more uniform light distribution, efficient heat dissipation, and improved mechanical protection, resulting in a thinner, lighter, and more efficient backlight with reduced dark spots and enhanced optical performance.
Implementation Method 1
light from the light source is guided through a transparent guide, typically made of plastic, by total internal reflection
Implementation Method 2
thermal bonding material in contact with the lower surface of the base substrate wherein the lower surface is opposite and parallel or substantially parallel to the first surface, and wherein said thermal bonding material contacts a heat sink plate and forms an air gap between the lower surface of the base substrate and the heat sink plate
Implementation Method 3
light is emitted in a substantially perpendicular direction to that of the direction of propagation of the light within the transparent guide. This is achieved through the light being directed so as to interact with scattering structures or films located within, or on the surface of, the transparent guide
Data Source
AI summary
This invention relates to light guide devices and methods of manufacture. The light guide device is suitable for use in a range of applications, particularly in connection with the backlighting of displays, for example, liquid crystal displays.