Light-Guided Capacitive Sensing Module for Accurate Housing Detection
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Solution Overview
Problem
Conventional capacitive sensing modules in electronic devices, such as laptops, often result in incorrect actions due to a poor sensing effect caused by the metal sensing structure being displaced from the housing and numerous electronic components intervening between the sensing structure and the housing.
Innovation Solution
A sensing module comprising a substrate, light-emitting units, a light-guiding assembly, sensing circuit structures, and a sensing processor, where the sensing circuit structures are positioned on the side surface of the light-guiding assembly, allowing for improved capacitance sensing and reduced occurrences of malfunctioning by emitting light beams outwardly through the housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the metal sensing structure is disposed away from the housing, then the device structure is simplified, but the sensing effect deteriorates
Solution Approach 1:
The patent introduces a light-guiding assembly as an intermediary component between the light-emitting unit and the sensing circuit structure. This assembly includes light-guiding structures that direct light beams to illuminate the sensing circuit structures, enabling indirect sensing while maintaining structural simplicity. The light-guiding assembly mediates the interaction between components, allowing the sensing structure to be positioned away from the housing while preserving sensing effectiveness.
2Adaptability or versatility
If numerous electronic components are disposed between the metal sensing structure and the housing, then functional requirements are met, but wrong actions occur frequently
Solution Approach 1:
The patent replaces the conventional direct electrical sensing mechanism with an optical sensing system. Light-emitting units generate light beams that pass through light-guiding structures to illuminate sensing circuit structures, converting the sensing mechanism from electrical field-based to optical field-based. This substitution eliminates interference from electronic components between the sensing structure and housing, significantly reducing wrong actions while maintaining functional versatility.
3Measurement precision
If the sensing circuit structure is positioned on the side surface of the light-guiding assembly, then sensing precision is improved, but device complexity increases
Solution Approach 1:
The patent positions the sensing circuit structure on the side surface of the light-guiding assembly rather than on the same plane as the light-emitting unit. This spatial arrangement in a different dimension allows the sensing circuit to detect capacitance changes more effectively by receiving light from the side, improving sensing precision. The light-guiding structures direct light beams to illuminate the side surface, enabling accurate sensing while integrating the component arrangement into the overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces incorrect actions by enhancing the sensing effectiveness of the capacitive sensing module, ensuring accurate control of electronic device components through improved capacitance detection.
Implementation Method 1
The at least one light-emitting unit is configured to emit a light beam outwardly through the at least one light-guiding structure
Implementation Method 2
The sensing processor is configured to sense a capacitance change in a peripheral area of the at least one sensing circuit structure by the at least one sensing circuit structure
Data Source
AI summary
A sensing module and an electronic device are provided. The sensing module includes a substrate, at least one light-emitting unit, a light-guiding assembly, at least one sensing circuit structure, and a sensing processor. The light-guiding assembly is connected to the substrate and includes at least one light-guiding structure. The at least one light-emitting unit is configured to emit a light beam outwardly through the at least one light-guiding structure. One end of the at least one sensing circuit structure is disposed on the substrate. The sensing processor is disposed on the substrate, and is configured to sense a capacitance change in a peripheral area of the at least one sensing circuit structure by the at least one sensing circuit structure and to generate a sensing signal. The sensing processor or an external controller is configured to control the at least one light-emitting unit according to the sensing signal.