Light-Guiding Structure With Mid-Height Minimum Width

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Solution Overview

Problem

Current semiconductor manufacturing methods face issues with light-guiding pillar collapse due to high rotation speeds during development and increased manufacturing time at low speeds, along with signal interference from scattering light.

Innovation Solution

A semiconductor structure featuring a light-guiding structure with a minimum width position between its top and bottom surfaces, aligned to a light sensing device, which allows for higher rotation speeds during development, reducing manufacturing time and minimizing photoresist residue, while its specific shape filters scattering light to reduce interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the rotation speed in developing procedure is increased, then the manufacturing time is reduced, but the light-guiding pillar collapses

Engineering Contradiction:
Improvemanufacturing timeVSAvoidlight-guiding pillar stability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent introduces a specific geometric parameter - the minimum width position of the light-guiding structure located between the top and bottom surfaces. This parameter change optimizes the structural distribution during development, allowing higher rotation speeds without collapse by distributing centrifugal forces more effectively throughout the pillar height.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent adds a vertical dimension consideration to the light-guiding structure design by positioning the minimum width at a specific height between top and bottom surfaces. This three-dimensional optimization allows the structure to withstand development forces better while maintaining manufacturing efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Reliability

If the rotation speed in developing procedure is decreased, then the light-guiding pillar stability is maintained, but the manufacturing time increases and photoresist residue occurs

Engineering Contradiction:
Improvelight-guiding pillar stabilityVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

By optimizing the minimum width position parameter vertically within the structure, the patent enables faster development speeds that completely remove photoresist without leaving residue, while still preventing pillar collapse through the optimized geometric distribution.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If the light-guiding structure is manufactured with conventional methods, then the manufacturing process is simple, but the signal is interfered by scattering light

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidscattering light interference
Core Design Contradiction:
Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The patent modifies the geometric parameters of the light-guiding structure, specifically the position of minimum width between top and bottom surfaces, to optimize light transmission properties. This reduces scattering light interference while maintaining compatibility with conventional lithographic manufacturing processes.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure prevents collapse, reduces manufacturing time, and effectively filters out scattering light interference, enhancing the semiconductor's performance and efficiency.

Implementation Method 1

the signal of the light-guiding pillar is interfered by the scattering light thereon

Methodology Applied
Scientific EffectLight scattering: Scattering

Implementation Method 2

a material of the light-guiding structure is a negative photoresist

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS10461200B1Semiconductor structure and manufacturing method thereof
Publication Date: 2019.10.29 MARLIN SEMICON LTD
  • US10461200B1 patent drawing

AI summary

A semiconductor structure including a substrate, a light sensing device and a light-guiding structure is provided. The light sensing device is disposed in the substrate. The light-guiding structure is located above the light sensing device. The light-guiding structure has a top surface and a bottom surface opposite to each other, and the bottom surface is closer to the substrate than the top surface. A position of a minimum width of the light-guiding structure is located between the top surface and the bottom surface.