Light-Induced Component Release Stack for Damage-Free Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for transferring semiconductor devices and photonics components are costly, inefficient, and prone to damage due to their fragility, especially when handling components of varying sizes.
Innovation Solution
A method involving a donor substrate with a release stack comprising an absorption layer, a melting layer, and an adhesive layer, where optical energy is used to melt the melting layer, allowing controlled release of components to an acceptor substrate through de-wetting, with a predefined release period and scanning path to manage energy distribution efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If complex pick-and-place equipment is used to transfer components, then the transfer can be performed without damaging components, but the equipment becomes expensive and slow with low transfer yield
Solution Approach 1:
The patent replaces complex mechanical pick-and-place equipment with a light-induced release system. A laser beam is used to locally heat and melt a release layer, causing components to be released from the donor substrate and transferred to the acceptor substrate through capillary action. This optical-thermal mechanism eliminates the need for complex mechanical grippers and positioning systems, dramatically improving transfer speed and yield while reducing equipment cost.
Solution Approach 2:
The patent utilizes phase transition of the release layer material. The release layer is designed to melt at a specific temperature when exposed to laser irradiation. This phase change from solid to liquid state causes the release layer to lose its adhesive properties, allowing components to be released. The controlled phase transition enables precise, damage-free transfer of components at high speed.
2Productivity
If laser power is increased to transfer larger components, then the transfer speed increases, but the risk of damaging components increases
Solution Approach 1:
The patent applies local quality by concentrating the laser energy only at the specific location of the release layer beneath each component. The laser beam is focused to a small spot size, heating only the release layer material directly underneath the component without affecting the component itself or surrounding areas. This localized heating enables controlled release of individual components or selectively grouped components without causing thermal damage, regardless of component size.
Solution Approach 2:
The patent changes the physical state parameter of the release layer by controlling its temperature through laser irradiation. By precisely controlling the laser power and duration, the release layer temperature is raised just enough to melt the material and trigger release, but not so high as to damage the component. This parameter control allows transfer of components of any size without increasing damage risk.
3Reliability
If the release period is extended to allow complete melting of the melting layer, then the release is more complete, but the transfer time increases
Solution Approach 1:
The patent uses periodic action by applying laser irradiation in controlled pulses or continuous scanning manner. The laser beam scans across the donor substrate or focuses on specific regions, providing thermal energy in a time-efficient manner. This periodic energy input achieves complete melting of the release layer rapidly, enabling full component release without extending the transfer time, thereby maintaining both reliability and productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables selective and rapid transfer of components of any size with reduced risk of damage, suitable for both small and large components, using lower-powered lasers and controlled energy delivery.
Implementation Method 1
an absorption layer for absorbing the optical energy
Implementation Method 2
a melting layer for being melted by heat from the absorption layer
Data Source
Figure 1A~1B
Figure 2~3
Figure 4A~4B
AI summary
The present document relates to a method for light-induced release of one or more components from a donor substrate to an acceptor substrate, and further relates to a donor substrate therefor. The melting layer of the release stack is provided with a predefined thickness for predefining the amount of optical energy to be received for releasing the at least one component, such as to establish a predefined release period determined by the optical power of the light beam. A full surface of at least one component is scanned, during a scan period shorter than the predefined release period, with a light beam along a scanning path, for providing the optical energy to the absorption layer, for releasing the at least one component.