Light-Mixing LED Package with Annular Resin Frames
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Solution Overview
Problem
Conventional lighting technologies such as incandescent and fluorescent bulbs suffer from quick attenuation, high power consumption, heat generation, fragility, and environmental pollution concerns, while LED lamps aim to address these issues but often lack high color render index and efficient light distribution.
Innovation Solution
A light-mixing type LED package structure is developed, comprising a substrate unit with chip-placing areas, surrounded by annular resin frames forming resin position limiting spaces, where high and low color temperature LED modules are connected in parallel, with translucent package resin bodies to enhance light-emitting efficiency and control light-projecting angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If LED modules with different color temperatures are connected in parallel, then color render index is improved, but device complexity increases
Solution Approach 1:
The LED package is segmented into multiple chip-placing areas on the substrate, with each area containing LED chips of different color temperatures (e.g., first chip-placing area with high color temperature LEDs, second chip-placing area with low color temperature LEDs). This segmentation allows independent control and optimization of each color temperature group while maintaining overall color rendering performance.
Solution Approach 2:
LED chips of different color temperatures are merged into a single integrated package structure, where multiple light-emitting modules are combined on one substrate. The annular resin frame and package resin body integrate these different color temperature sources into one unified light source, achieving high color render index while simplifying the overall lighting system.
2Manufacturing precision
If annular resin frames are used to limit resin position, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The annular resin frames are pre-formed and positioned on the substrate before the package resin is applied. This preliminary action establishes precise boundaries for resin placement, ensuring accurate positioning of the package resin over the LED chips. The frames serve as molds or guides that automatically define the resin shape and position during the packaging process.
Solution Approach 2:
The annular resin frames act as intermediary structures between the substrate and the package resin. These frames provide a physical boundary and structural support that mediates the positioning process, allowing the package resin to be precisely contained and shaped without requiring complex external positioning mechanisms.
3Productivity
If multiple translucent package resin bodies are used to cover different LED modules, then light-emitting efficiency is improved, but device complexity increases
Solution Approach 1:
Different translucent package resin bodies are applied to different chip-placing areas, with each resin body optimized for its specific LED module. For example, the first package resin body covers the high color temperature LEDs while the second package resin body covers the low color temperature LEDs. This local optimization allows each resin to be tailored for maximum light extraction efficiency for its specific LED type, while the overall package structure remains integrated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the color render index by mixing light from high and low color temperature modules, improving light-emitting efficiency and adjusting light-projecting angles, while reducing environmental impact and enhancing durability compared to traditional lighting.
Implementation Method 1
the shape of the translucent package resin body can be adjusted by using the annular resin frame. Therefore, the present invention can apply to increase light-emitting efficiency of LED chips and control light-projecting angle of LED chips
Implementation Method 2
the blue light beams generated by the LED chips can be reflected by an inner wall of the annular resin frame in order to increase the light-emitting efficiency of the LED package structure
Implementation Method 3
an LED module with high color temperature and an LED module with low color temperature connected each other in parallel in order to create the light-mixing type LED package structure with high color render index
Data Source
AI summary
A light-mixing type LED package structure for increasing color render index includes a substrate unit, a light-emitting unit, a frame unit and a package unit. The light-emitting unit has a first light-emitting module for generating a first color temperature and a second light-emitting module for generating a second color temperature. The frame unit has two annular resin frames surroundingly formed on the top surface of the substrate unit by coating. The two annular resin frames respectively surround the first light-emitting module and the second light-emitting module in order to form two resin position limiting spaces above the substrate unit. The package unit has a first translucent package resin body and a second translucent package resin body both disposed on the substrate unit and respective covering the first light-emitting module and the second light-emitting module.