Light-Mixing Multichip Package for High CRI Illumination
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Solution Overview
Problem
Traditional LED package structures have inadequate Color Render Index (CRI), which limits their ability to provide high-quality indoor illumination compared to incandescent and fluorescent bulbs.
Innovation Solution
A light-mixing multichip package structure comprising a substrate unit with red and blue light-emitting modules, surrounded by continuous colloid frames and covered with transparent and phosphor colloid bodies, which mix red and blue light sources to enhance CRI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional LED package structures are used, then power consumption is reduced compared to incandescent bulbs, but Color Render Index (CRI) is insufficient
Solution Approach 1:
The patent combines multiple LED chips with different emission wavelengths (red, green, blue) into a single package structure, allowing them to work together to produce high-CRI white light while maintaining LED energy efficiency. The multiple chips are integrated on a common substrate with shared electrical connections and heat dissipation pathways.
Solution Approach 2:
The patent uses a composite approach by integrating multiple semiconductor materials with different bandgaps (red LED chips, green LED chips, blue LED chips) on a single substrate, creating a multi-material system that achieves superior color rendering while maintaining low power consumption characteristics of LED technology.
2Reliability
If multiple LED chips are integrated to improve CRI, then color rendering capability increases, but device complexity increases
Solution Approach 1:
The patent merges multiple LED chips, electrical connections, and heat dissipation structures into a single integrated package unit. All components are combined on one substrate with unified electrical input terminals, simplifying the overall system architecture despite containing multiple functional elements.
Solution Approach 2:
The substrate serves multiple functions simultaneously: it provides mechanical support for mounting multiple LED chips, acts as an electrical interconnection layer connecting all chips to common input terminals, and functions as a heat dissipation pathway. This multi-functionality reduces the need for separate components and simplifies the overall structure.
3Illumination intensity
If red and blue light-emitting modules are separated on different chip placing areas, then light mixing capability improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the substrate into multiple distinct chip placing areas, with each area dedicated to specific wavelength LEDs (red, green, or blue). This segmentation allows for optimized optical paths and color mixing zones while providing clear manufacturing guides for chip placement, reducing precision requirements through structured zoning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure significantly increases the CRI by combining red and blue light sources, improving luminous flux, light power efficiency, and color rendering capabilities, while reducing heat transmission and enhancing light-emitting efficiency.
Implementation Method 1
a phosphor colloid body disposed on the top surface of the substrate body to cover the second light-emitting module
Implementation Method 2
a plurality of red light-emitting chips disposed on and electrically connected to one of the chip placing areas
Implementation Method 3
a plurality of blue light-emitting chips disposed on and electrically connected to the other chip placing area
Data Source
AI summary
A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a frame unit, and a package unit. The light-emitting unit includes at least one first light-emitting module with red light-emitting chips and at least one second light-emitting module with blue light-emitting chips. The frame unit includes at least one first continuous colloid frame and at least one second continuous colloid frame respectively surrounding the first light-emitting module and the second light-emitting module. The package unit includes a transparent colloid body and a phosphor colloid body respectively covering the first light-emitting module and the second light-emitting module. Hence, when the red light source generated by matching the red light-emitting chips and the transparent colloid body and the white light source generated by matching the blue light-emitting chips and the phosphor colloid body are mixed with each other, the CRI of the light-mixing multichip package structure can be increased.