Light-Mixing Multichip LED Package for High CRI
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Solution Overview
Problem
Traditional LED package structures have limitations in color render index (CRI) and utilization rate of LED chips, including quick attenuation, high power consumption, high heat generation, short working life, fragility, and non-recyclability compared to LED lamps.
Innovation Solution
A light-mixing multichip package structure comprising a substrate unit, light-emitting unit, package unit, and frame unit, where the light-emitting unit includes series-connected first and second light-emitting groups with parallel-connected blue and red LED chips, and a phosphor resin body covers these groups within a surrounding light-reflecting frame to enhance CRI and utilization rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional LED package structures are used, then the structure is simple and easy to manufacture, but the color render index and utilization rate of LED chips are insufficient
Solution Approach 1:
The light-emitting unit is divided into multiple light-emitting groups (first light-emitting groups with blue LED chips and second light-emitting groups with red LED chips), each group containing multiple parallel connection units. This segmentation allows independent optimization of different wavelength components to improve color render index while maintaining manageable manufacturing complexity through modular assembly.
Solution Approach 2:
The patent combines multiple light-emitting groups with different LED chip types (blue and red) into a single integrated light-emitting unit, which is then covered by a phosphor resin body. This merging of different wavelength sources with phosphor conversion creates a unified optical system that achieves high color render index without requiring separate lighting fixtures for different color temperatures.
2Manufacturing precision
If multiple LED chips are used to improve color render index, then the utilization rate of LED chips increases, but the electrical connection complexity and heat generation increase
Solution Approach 1:
The light-emitting groups are divided into series-connected units, where each unit contains parallel-connected LED chips. This segmentation distributes the total current across multiple series units, reducing the current burden on each individual chip group and thereby reducing heat generation per unit while maintaining high overall utilization rate through the combined output of all chips.
Solution Approach 2:
Different light-emitting groups are assigned different functions: first light-emitting groups with blue LED chips provide specific wavelength components, while second light-emitting groups with red LED chips provide complementary wavelengths. This local functional differentiation optimizes the contribution of each chip group to the overall color rendering, maximizing utilization rate while distributing heat generation across specialized zones.
3Manufacturing precision
If series connection of light-emitting groups is used, then the utilization rate of LED chips improves, but the electrical connection complexity increases
Solution Approach 1:
The electrical connection system is segmented into modular light-emitting groups, where each group is a self-contained unit with internal parallel connections. The series connection between groups creates a hierarchical structure that simplifies the overall wiring scheme compared to fully individual connections, as entire groups can be treated as single electrical units during assembly while still achieving high utilization rates through the series configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure increases the color render index and utilization rate of LED chips by optimizing the electrical connections and packaging, leading to improved performance and efficiency.
Implementation Method 1
The package unit includes a phosphor resin body disposed on the substrate body to cover the first light-emitting groups and the second light-emitting groups
Implementation Method 2
The frame unit includes a surrounding light-reflecting frame surrounding the first light-emitting groups, the second light-emitting groups, and the phosphor resin body
Data Source
AI summary
A light-mixing multichip package structure includes a substrate unit, a light-emitting unit, a package unit, and a frame unit. The substrate unit includes a substrate body. The light-emitting unit includes a plurality of first and second light-emitting groups. The first and the second light-emitting groups are disposed on the substrate body and electrically connected to the substrate body in series. Each first light-emitting group includes a plurality of first parallel connection units electrically connected in parallel, and each first parallel connection unit includes at least one blue LED chip, and each second light-emitting group includes at least one red LED chip. The package unit includes a phosphor resin body disposed on the substrate body to cover the first and the second light-emitting groups. The frame unit includes a surrounding light-reflecting frame surrounding the first and the second light-emitting groups and the phosphor resin body.