Light-Mixing Multichip Package Structure for LED Luminosity
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Solution Overview
Problem
Traditional lighting devices such as incandescent and fluorescent bulbs have issues with quick attenuation, high power consumption, high heat generation, short working life, fragility, and non-recyclability, necessitating the development of more efficient LED package structures.
Innovation Solution
A light-mixing multichip package structure comprising a circuit substrate, multiple light-emitting modules, and package bodies with light-reflecting bodies to enhance color rendering and luminosity, where light-emitting elements are electrically connected and encapsulated within package bodies with curved light output surfaces, and surrounded by additional light-emitting elements and reflective bodies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional incandescent or fluorescent bulbs are used, then lighting function is provided, but power consumption is high and working life is short
Solution Approach 1:
The patent divides the lighting system into multiple independent LED chips (first light-emitting elements and second light-emitting elements) mounted on a circuit substrate. Each LED chip operates independently, allowing for extended working life without the limitations of traditional bulbs. The segmentation of light-emitting elements enables modular replacement and maintains low power consumption while achieving high reliability.
2Temperature
If traditional incandescent or fluorescent bulbs are used, then lighting function is provided, but heat generation is high
Solution Approach 1:
The patent introduces a light-reflecting body as an intermediary component between the LED chips and the external environment. This light-reflecting body reflects light emitted by the first and second light-emitting elements, improving light extraction efficiency without generating additional heat. The package body serves as another intermediary that encapsulates and protects the LED chips while managing thermal dissipation, thereby reducing heat generation and extending working life.
3Illumination intensity
If multiple light-emitting elements are added to improve color rendering and luminosity, then light output quality improves, but device complexity increases
Solution Approach 1:
The patent merges multiple light-emitting elements (first light-emitting elements and second light-emitting elements) with different spectral characteristics onto a single circuit substrate. This combining approach enables improved color rendering and luminosity while sharing common support structures, electrical connections, and packaging components. The light-reflecting body and package body serve as shared elements that manage light from multiple sources, reducing overall device complexity compared to separate lighting units.
Solution Approach 2:
The package body serves multiple functions simultaneously: it encapsulates and protects the LED chips, provides structural support, manages thermal dissipation, and facilitates light extraction. The circuit substrate also performs multiple roles by mounting light-emitting elements, providing electrical connections, and serving as a mechanical platform. This multi-functionality reduces the need for additional components, thereby limiting the increase in device complexity while achieving improved luminosity and color rendering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design increases both the color rendering property and luminosity of the light-mixing multichip package structure by effectively utilizing multiple light-emitting elements and reflective bodies to optimize light output and distribution.
Implementation Method 1
a first light-reflecting body surroundingly disposed on the circuit substrate to surround the first light-emitting module by coating
Data Source
AI summary
A light-mixing multichip package structure includes a circuit substrate, a first light-emitting module, a first package body, a second light-emitting module and a second package body. The first light-emitting module includes a plurality of first light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate. The first package body is disposed on the circuit substrate to enclose the first light-emitting elements. The second light-emitting module includes a plurality of second light-emitting elements disposed on the circuit substrate and electrically connected to the circuit substrate, and the first light-emitting module and the first package body are surrounded by the second light-emitting elements. The second package body is disposed on the circuit substrate to enclose the first light-emitting module, the second light-emitting module and the first package body.