Light Emitting Module Dimming Structure for Uniform Backlight Output
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Solution Overview
Problem
Current backlight modules using LEDs suffer from uneven light output due to high directivity of LED chips, leading to dark areas and increased costs when trying to improve visual experience by reducing spacing between LEDs.
Innovation Solution
A light emitting module with dimming structures that have varying thicknesses, partially transmitting and reflecting light, integrated into the encapsulant material to adjust brightness and enhance uniformity, while maintaining or reducing the number of LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the spacing between light emitting elements is reduced to eliminate dark areas, then the light output uniformity is improved, but the number of light emitting diodes increases resulting in cost increase
Solution Approach 1:
The patent applies local quality by introducing dimming structures with varying thicknesses at different locations above the LED chips. These structures have different light transmission rates, allowing selective dimming of specific regions. This enables uniform overall light output without needing to reduce LED spacing, thus avoiding increased component count and cost.
2Illumination intensity
If LED chips with high directivity are used to achieve high brightness, then the brightness directly above LED chips is improved, but the light output becomes uneven
Solution Approach 1:
The dimming structures are designed with varying thicknesses to create different light transmission rates in different regions. Thicker dimming structures are placed above brighter LED chips to reduce their intensity, while thinner structures are placed in darker regions. This local adjustment achieves uniform light output while preserving the high brightness capability of individual LED chips.
Solution Approach 2:
The patent changes the optical parameters of the light transmission path by introducing dimming structures with controlled thicknesses. These structures modify the effective transmission rate of light from different LED chips, transforming the non-uniform light distribution into a uniform overall output without changing the LED chip characteristics themselves.
3Device complexity
If the encapsulant thickness is reduced to shorten light transmission path, then the manufacturing complexity is reduced, but the light output uniformity deteriorates
Solution Approach 1:
Instead of uniformly increasing encapsulant thickness, the patent introduces localized dimming structures with varying thicknesses positioned above specific LED chips. This approach achieves the needed light transmission control with minimal additional complexity, as the dimming structures can be integrated into the existing encapsulant design rather than redesigning the entire encapsulant layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module achieves uniform light output and reduces the need for increased LED density, thereby lowering manufacturing costs and improving visual experience without increasing the spacing between LEDs.
Implementation Method 1
dimming structures that have varying thicknesses, partially transmitting and reflecting light
Data Source
AI summary
A light emitting module is provided. The light emitting module includes a substrate, light emitting elements, an encapsulant material and dimming structures. The light emitting elements are disposed over the substrate. The encapsulant material covers the light emitting elements and the substrate, and the encapsulant material has an encapsulant height H. The dimming structures are disposed over the encapsulant material or embedded in the encapsulant material. The dimming structures have a maximum dimming thickness h. The encapsulant thickness H and the maximum dimming thickness h satisfy the following relationship: 0.01≤h/H≤1.